Integrated Card Rail Cooling Module for Embedded Systems
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Solution Overview
Problem
Circuit module chassis assemblies face challenges in efficiently dissipating heat from high-speed, high-performance circuit cards, particularly in applications where traditional cooling methods are insufficient for maintaining the required temperature range, especially in size, weight, and cost-constrained systems.
Innovation Solution
An integrated flow-through card rail module with a base plate, elongated guide rails, and a corrugated structure that includes cooling passages for fluid flow-through convection, allowing for efficient heat dissipation through both conduction and forced convection, utilizing a cooling fluid to direct heat away from electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling methods (natural/forced convection through rail structure) are used, then the cooling system is simple and reliable, but it cannot effectively dissipate heat from high-speed, high-performance circuit cards
Solution Approach 1:
The patent merges the card rail structure with the cooling system by integrating cooling passages directly into the rail components. The rail structure itself becomes part of the cooling system, eliminating the need for separate cooling elements and reducing overall system complexity while improving heat dissipation effectiveness.
Solution Approach 2:
The card rail structure is given multiple functions: it provides mechanical support for circuit cards, electrical interconnection, and thermal management through integrated cooling passages. This multi-functionality reduces the number of separate components needed and simplifies the overall system while enhancing cooling capability.
2Reliability
If flow-through technology with cooling fluid is introduced, then heat dissipation capability is improved, but the system size and complexity increase
Solution Approach 1:
The cooling passages are merged with the card rail structure, allowing cooling fluid to flow through the rail components themselves. This integration eliminates the need for separate cooling channels and reduces system complexity while maintaining effective heat dissipation through the flow-through mechanism.
3Reliability
If cooling passages are integrated into the card rail, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The cooling passages are segmented into multiple sections within the card rail structure, allowing for modular manufacturing and assembly. This segmentation enables the rail to be produced in sections that can be independently manufactured and then assembled, reducing the difficulty of creating complex integrated structures in a single manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated card rail and cooling module effectively maintains circuit cards within a specified temperature range by combining conduction and forced convection cooling, enhancing thermal management in embedded computing systems while maintaining compactness and compatibility with existing standards.
Implementation Method 1
conducting heat away from the electronics through the circuit board and/or rail structure
Implementation Method 2
dissipating heat from the rail structure through natural or forced convection
Data Source
AI summary
A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.