Card Reader Optical Sensor Dust Prevention and Module Exchange
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Solution Overview
Problem
Card readers face issues with dust and dirt accumulation on optical sensors due to environmental factors, leading to incorrect card detection and increased complexity in exchanging IC contact modules and magnetic head assemblies.
Innovation Solution
The card reader design incorporates cover members for optical sensors and a simplified structure for IC contact modules, allowing for easy exchange without turning mechanisms, and a magnetic head module that can be swapped without operational holes in the circuit board, ensuring effective dust prevention and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If through-holes are formed in guide blocks for optical sensor operation, then light transmission is enabled, but dust and dirt can enter and stick to the optical elements
Solution Approach 1:
The patent divides the optical system into separate sealed modules (first and second optical elements in separate housings) connected by aligned through-holes. Each housing can be independently sealed and maintained, allowing the optical path to remain open for light transmission while keeping dust contamination isolated to specific sealable compartments.
Solution Approach 2:
The patent introduces transparent covers or windows as intermediary elements that seal the through-holes while allowing light to pass through. These covers act as barriers between the optical transmission path and the external environment, preventing dust entry while maintaining optical functionality.
2Ease of repair
If IC contact modules are made exchangeable with turning mechanisms, then module replacement is enabled, but device complexity increases
Solution Approach 1:
The patent separates the IC contact module into an independently removable unit that can be exchanged without affecting other components. The module is designed as a discrete assembly with its own mounting structure, allowing straightforward installation and removal without complex turning mechanisms.
Solution Approach 2:
Instead of using a turning mechanism to achieve module exchange, the patent inverts the approach by designing the module to be directly accessible and removable from a fixed position. The module mounting structure allows extraction and insertion without rotational movement, simplifying the exchange process.
3Ease of repair
If magnetic head assemblies require operational holes in circuit boards for attachment, then magnetic head replacement is enabled, but circuit board size increases
Solution Approach 1:
The patent moves the magnetic head assembly attachment mechanism from a two-dimensional circuit board plane to a three-dimensional structure using side-mounted brackets or clips on the device housing. This allows the magnetic head to be secured and replaced without requiring additional space on the circuit board, utilizing the vertical or lateral dimension instead.
Solution Approach 2:
The patent extracts the magnetic head assembly mounting function from the circuit board entirely, placing it on separate structural components such as the device housing or a dedicated support frame. This separation allows the circuit board to maintain its minimal necessary size while the magnetic head remains exchangeable through side-access mounting mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents dust and dirt from sticking to optical sensors, facilitates easy exchange of IC contact modules, and allows for efficient magnetic head module replacement without increasing circuit board size, enhancing reliability and usability.
Implementation Method 1
an optical sensor including a light emitting element and a light receiving element which are disposed oppositely in a state interposing the card conveying passage
Data Source
AI summary
A card reader may include a conveyance passage; an optical sensor; a first circuit board; a second circuit board; a first cover member; a second cover member; a first frame; and a second frame comprising a conveyance face on a second direction side of the card conveyance passage. The first frame may include a first transmission hole, and the first frame may be attached with one of the first circuit board and the second circuit board. The second frame may include a second transmission hole, and the second frame may be attached with the other of the first circuit board and the second circuit board. The first cover member may be fixed to the first circuit board so as to cover the entire light emitting element; and the second cover member may be fixed to the second circuit board so as to cover the entire light receiving element.