Card Retainer With L-Shaped Brackets for Thermal-Mechanical Interface
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Solution Overview
Problem
Current card retainer devices used in separable thermal-mechanical interfaces face challenges in minimizing forces applied to the chassis while maximizing heat transfer, leading to potential chassis deflection and thermal resistance issues, especially in high-power computing applications.
Innovation Solution
A card retainer device with first and second wedge members and a tightening element, featuring integrated L-shaped brackets and bracket extensions that distribute force orthogonally to minimize chassis deflection and enhance heat transfer by maximizing surface contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a wedge lock card retainer is used to clamp the card module to the chassis, then the card-to-chassis heat transfer is improved, but the forces applied to the chassis side-walls increase causing chassis deflection
Solution Approach 1:
The patent introduces L-shaped brackets as intermediary elements between the wedge lock mechanism and the chassis side-walls. These brackets distribute the clamping forces from the wedges to multiple contact points on the chassis, reducing the concentrated forces that cause deflection while maintaining the necessary clamping pressure for heat transfer between the card and chassis.
Solution Approach 2:
The L-shaped brackets extend the force distribution in a different spatial dimension by providing both vertical and horizontal support surfaces. This dimensional extension allows the retainer to apply clamping force effectively while distributing reaction forces across a larger volume of the chassis structure, reducing localized stress and deflection.
2Temperature
If the chassis is completely sealed for thermal management, then the thermal connection is improved, but the thermal resistance at the STMI interface increases
Solution Approach 1:
The card retainer device uses a composite construction combining highly thermally conductive materials (such as aluminum or copper) for the wedge members and L-shaped brackets, while the chassis and card housing may use structurally optimized materials. This composite approach maximizes thermal conductivity at the critical STMI interface while maintaining the sealed chassis structure for overall thermal management.
Solution Approach 2:
The patent merges the mechanical clamping function with the thermal conduction function into a single integrated component structure. The wedge members and L-shaped brackets simultaneously provide the necessary mechanical force to clamp the card while serving as thermal pathways, eliminating the need for separate thermal management components and reducing interface thermal resistance.
3Strength
If the wedge lock is designed primarily as a clamp, then the card retention is improved, but the thermal conductivity of the device itself is reduced
Solution Approach 1:
The wedge members and L-shaped brackets are designed to perform multiple functions simultaneously: providing mechanical clamping force to retain the card in the chassis, distributing forces to minimize deflection, and serving as thermal conduction pathways. This multi-functionality eliminates the trade-off between retention strength and thermal conductivity by making both functions integral to the same components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces chassis deflection and thermal resistance by distributing force efficiently, allowing for higher computational power while maintaining component operating temperatures through enhanced heat transfer without compromising the structural integrity of the chassis.
Implementation Method 1
The device achieves the desired card clamping force to retain the card in the chassis rails by actuating a series of trapezoidal 'wedges'
Implementation Method 2
When the threaded fastener is turned, it advances the end wedge, and force is applied to the wedge interfaces causing outward motion of the wedges
Implementation Method 3
Heat is conducted from the card mounted electronics to the STMI, where the card retainer clamps the card tab into the chassis guide. Heat is conducted through this interface to the chassis walls
Implementation Method 4
When the threaded fastener is turned, it advances the end wedge
Data Source
AI summary
A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with integrated brackets integrally attached to the main portions, the integrated brackets form first L-shaped brackets which engage walls of the chassis, surfaces of the card module or a combination thereof. The L-shaped brackets provide bearing surfaces which reduces binding and wear when the card retainer device secures the card module in the channel of a chassis and enhances the conductance of heat through the card retainer device. The wedge members provide heat transfer paths between the card module and the chassis. Mating surfaces of mating wedge member interfaces have compound angles that produces an applied force orthogonal to a flange of the conduction card that is greater than the force applied parallel to the flange of the conduction card.