Card-Type Wireless Transceiver Resin Encapsulation
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Solution Overview
Problem
Conventional wireless transceivers for vehicles have high defect rates due to exposed circuit board components, leading to corrosion, mechanical stress, and increased manufacturing costs, as well as the need for additional processing steps to achieve a decorative appearance.
Innovation Solution
A card-type wireless transceiver design with a circuit board embedded in a resin case, featuring a battery accommodation member and an emergency key accommodation device with a reinforcement unit, where the circuit board is supported by pins and encapsulated on both sides with resin using a high-temperature and high-pressure press process, reducing exposure and eliminating post-processing needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is attached to the bottom of the molding die for encapsulation, then the circuit board can be protected from corrosion and damage, but one side of the circuit board remains exposed requiring additional post-treatment processes
Solution Approach 1:
The invention introduces a support pin that divides the encapsulation space into two separate cavities, allowing each side of the circuit board to be independently encapsulated in resin. This segmentation enables full coverage protection without requiring post-treatment processes, as both surfaces are simultaneously enclosed during the initial molding operation.
Solution Approach 2:
The support pin extends vertically through the circuit board, creating a three-dimensional encapsulation structure. This dimensional approach allows resin to fill cavities on both sides of the circuit board simultaneously, achieving complete surface coverage and eliminating the need for subsequent painting or plating processes.
2Ease of manufacture
If the circuit board is fully encapsulated in resin, then the appearance is improved and post-treatment is eliminated, but the manufacturing process becomes more complex
Solution Approach 1:
The support pin serves as an intermediary element that facilitates the encapsulation process. By introducing this simple structural component, the system achieves full circuit board coverage without requiring complex multi-step manufacturing processes. The support pin is removed after encapsulation, leaving a clean finished product without additional post-treatment needs.
3Productivity
If the circuit board is exposed to the outside, then the manufacturing process is simpler, but the conductive material surface is easily corroded causing malfunction
Solution Approach 1:
The invention performs preliminary encapsulation action during the initial molding process. By enclosing both sides of the circuit board in resin before any post-treatment operations, the conductive materials are protected from corrosion from the outset. This preliminary protection eliminates the need for subsequent painting or plating that would be required if the board remained exposed.
4Device complexity
If the circuit board is exposed, then no additional encapsulation is needed, but flexure occurs due to thermal expansion coefficient differences
Solution Approach 1:
The support pin creates segmented encapsulation cavities on either side of the circuit board. This segmentation allows the resin to uniformly support both surfaces, distributing thermal stress evenly and preventing flexure caused by differential thermal expansion between the circuit board and encapsulating material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the thickness of the wireless transceiver, reduces manufacturing steps and costs, enhances product reliability, and prevents resin warping, while maintaining a decorative appearance without additional post-processing.
Implementation Method 1
encapsulated on both sides with resin using a high-temperature and high-pressure press process
Implementation Method 2
the exposure of the one side of the circuit board to the outside causes flexure of the body of the circuit board due to the difference between the thermal expansion coefficients of the circuit board and the resin sealant
Implementation Method 3
an emergency key accommodation device having a reinforce unit installed on the other side of the circuit board and connected to the circuit board through a soldering process
Data Source
AI summary
Disclosed is a wireless transceiver for a vehicle and a method of manufacturing the same. In a wireless transceiver manufacturing process according to the present disclosure and a method of manufacturing the same, both of the top and bottom sides of a circuit board, on which components are mounted, are encapsulated using a resin material in a state where the circuit board floats in a cavity. A pin configured to support the circuit board is installed and a decoration flat member is fixed to the surface of the circuit board opposite to the side where the pin is installed using double-sided tape. As a result, it is possible to prevent the resin case from being warped by heat generated from the circuit board. In addition, it is possible to omit an existing post-processing process for preventing the damage to the circuit board which may be caused when one side of the circuit board is exposed to the outside as it is. Thus, steps of the manufacturing process and the manufacturing costs can be reduced.