Care-Area Swath Scanning for Throughput and Sensitivity
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Solution Overview
Problem
Current semiconductor inspection tools face inefficiencies and inaccuracies due to constant-speed scanning, which compromises both throughput and sensitivity, especially when inspecting small features like thin line-space redistribution layers (RDLs) in advanced wafer-level packaging.
Innovation Solution
Implementing a variable feed rate scanning method where a fast feed rate is used for regions outside of critical areas and a slow feed rate for areas of interest, such as RDLs, using a particle beam emitter and detector system with a controller to adjust the stage position relative to the incidence, thereby optimizing throughput and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the feed rate is made slow to increase sensitivity, then sensitivity is improved, but throughput decreases
Solution Approach 1:
The scan region is divided into multiple swaths, with different feed rates assigned to different swaths. Critical areas (care areas) are scanned at slow feed rates to maximize sensitivity, while non-critical areas are scanned at fast feed rates to maintain throughput. This segmentation resolves the contradiction by applying different scanning speeds to different regions rather than using a single constant speed for the entire die.
Solution Approach 2:
Different quality levels of inspection are applied to different regions of the die. Care areas containing RDLs receive high-quality inspection with slow feed rates, while non-care areas receive lower-quality inspection with fast feed rates. This local differentiation allows the system to optimize sensitivity where needed without sacrificing overall throughput.
2Productivity
If the feed rate is increased to improve throughput, then throughput is improved, but sensitivity decreases
Solution Approach 1:
The scan region is segmented into multiple swaths with differentiated feed rate assignments. Non-critical swaths are scanned at fast feed rates to maximize throughput, while critical swaths containing RDLs are scanned at slow feed rates to ensure sensitivity. This resolves the contradiction by allowing high throughput overall while maintaining sensitivity in critical regions.
Solution Approach 2:
The system applies slow feed rates (excessive action for sensitivity) only to the extent necessary for detecting defects in RDLs, rather than applying it to the entire die. By limiting slow scanning to only care areas, the system achieves sufficient sensitivity where needed without unnecessarily reducing overall throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances inspection efficiency by reducing time spent on non-critical regions while maintaining high sensitivity, allowing for improved detection of defects in small RDLs, thus improving overall semiconductor production yield and reducing production time.
Implementation Method 1
The scanning may include emitting particles in a particle beam toward the die resulting an incidence on the die
Implementation Method 2
The detecting may be performed using a detector. The scanning may then include detecting a portion of particles reflected from the incidence
Data Source
AI summary
Embodiments may include methods, systems, and apparatuses for care area based swath speed for throughput and sensitivity improvement. A method may comprise receiving scan region of a die. The scan region of the die may have a first care area at a controller configured to control an inspection tool, wherein the inspection tool includes a stage having the die disposed thereon. The method may then include scanning a first portion of the scan region at a fast feed rate and the first care area at a slow feed rate. Scanning may include emitting particles in a particle beam toward the die resulting an incidence on the die. Emitting may be performed using a particle emitter. Scanning may then include detecting a portion of particles reflected from the incidence. Detecting may be performed using a detector. Scanning may then include changing a position of the stage relative to the incidence.