Composite Carrier Absorption Layer for Fast Laser De-Bonding

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Solution Overview

Problem

Existing methods for de-bonding permanently bonded carriers in integrated circuit packaging are inefficient and costly, often requiring chemical mechanical polish, grinding, or etching processes that can damage the carrier and increase production time.

Innovation Solution

A composite carrier is developed with a base carrier that is transparent to a specific laser wavelength and an absorption layer that absorbs laser energy, allowing for laser ablation and efficient de-bonding without damaging the carrier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chemical mechanical polish, grinding, or etching processes are used to de-bond permanently bonded carriers, then the carrier can be separated from package components, but the process is time-consuming and may damage the carrier

Engineering Contradiction:

Improvecarrier integrityVSAvoidde-bonding process time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The carrier is divided into two functional layers: a base carrier layer and a laser absorption layer. The absorption layer is specifically designed to absorb laser energy and undergo ablation, while the base carrier remains intact. This segmentation allows selective removal of only the absorption layer through laser irradiation, enabling rapid de-bonding without damaging the base carrier or requiring time-consuming mechanical processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces mechanical de-bonding methods (chemical mechanical polishing, grinding, etching) with a laser-based thermal ablation process. The laser absorption layer converts optical energy to thermal energy, which rapidly heats and ablates the layer, separating the carrier from package components in seconds without mechanical contact, thereby eliminating the time-consuming and potentially damaging mechanical processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If traditional de-bonding methods are used, then carrier separation is achieved, but production costs increase due to process complexity and carrier damage

Engineering Contradiction:

Improvede-bonding process simplicityVSAvoidproduction cost

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The laser absorption layer is pre-applied to the base carrier during carrier fabrication. This preliminary action ensures that the carrier is pre-configured with the necessary functional layer for laser de-bonding, eliminating the need for complex post-bonding processing steps and reducing overall manufacturing complexity and cost.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the optical parameters of the carrier by adding a layer with specific laser absorption characteristics. This parameter change enables the carrier to respond to laser irradiation by selectively ablating the absorption layer, providing a simple and cost-effective de-bonding method that replaces complex mechanical processes.

Inventive Principle:

Principle #35Parameter changes

3Use of energy by moving object

If the base carrier is made opaque to laser wavelength, then laser energy can be absorbed, but the laser cannot penetrate through to ablate the absorption layer

Engineering Contradiction:

Improvelaser energy absorptionVSAvoidablation precision

Core Design Contradiction:

Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

The patent applies local quality by giving different optical properties to different layers: the base carrier is made transparent to the laser wavelength to allow penetration, while the absorption layer is made opaque to absorb laser energy and undergo ablation. This localized differentiation of optical properties enables precise and controlled ablation of only the absorption layer without affecting the base carrier.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laser de-bonding process allows for rapid and cost-effective separation of the base carrier from the package component, enabling carrier reuse, reducing production costs, and improving throughput.

Implementation Method 1

an absorption layer that absorbs laser energy, allowing for laser ablation

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

a base carrier that is transparent to a specific laser wavelength

Methodology Applied

Scientific EffectLight transmission:

Implementation Method 3

allowing for laser ablation and efficient de-bonding

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 4

The LTHC may be decomposed using laser

Methodology Applied

Scientific EffectPhotothermal conversion:

Data Source

PatentUS12347696B2Laser de-bonding carriers and composite carriers thereof

Publication Date: 2025.07.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes bonding a package component to a composite carrier. The composite carrier includes a base carrier and an absorption layer, and the absorption layer is between the base carrier and the package component. A laser beam is projected onto the composite carrier. The laser beam penetrates through the base carrier to ablate the absorption layer. The base carrier may then be separated from the package component.