Carrier Structure With Variable Thermal Expansion Adhesive
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Solution Overview
Problem
Carrier structures with special designs complicate manufacturing processes, leading to a significant degradation in yield rates during the production of electronic elements like diodes, optic sensors, and micro lens sets.
Innovation Solution
A carrier structure design utilizing an adhesive layer with varying thermal expansion coefficients, forming an inclined structure upon completion, allows for easier wiring, crystallization, and die-attaching processes by expanding after these steps are completed, maintaining a good yield rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a carrier structure with special design is used to adapt to various electronic elements, then the adaptability is improved, but the manufacturing process complexity increases and yield rate deteriorates
Solution Approach 1:
The adhesive layer is designed with different thermal expansion coefficients in different regions (first region with higher expansion coefficient, second region with lower expansion coefficient), allowing the carrier structure to achieve complex 3D configurations and adapt to various electronic elements while maintaining a relatively simple overall structure that does not significantly complicate manufacturing processes
Solution Approach 2:
The invention utilizes thermal expansion parameter changes by heating the adhesive layer to cause differential expansion between the first and second regions, transforming the carrier structure from a flat state to an inclined 3D state. This parameter-based transformation allows adaptability to various electronic elements without requiring complex structural designs
2Adaptability or versatility
If a carrier structure with special design is used to adapt to various electronic elements, then the adaptability is improved, but the yield rate significantly deteriorates
Solution Approach 1:
The invention performs critical manufacturing processes (wiring, crystallization, die-attaching) on the adhesive layer before thermal expansion occurs. By completing these sensitive operations while the adhesive layer is still in its initial state with stable properties, the yield rate is maintained while the subsequent expansion provides the needed adaptability for various electronic elements
3Adaptability or versatility
If the adhesive layer is designed with varying thermal expansion coefficients to form an inclined structure, then the adaptability to various products is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The adhesive layer incorporates different materials or compositions in different regions to create varying thermal expansion coefficients, enabling the formation of inclined 3D structures that adapt to various products while the manufacturing process remains straightforward as it only requires standard material deposition and thermal processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inclined feature of the carrier structure adapts to various electronic elements, facilitating efficient manufacturing processes and maintaining a high yield rate by performing critical processes before adhesive expansion.
Implementation Method 1
A thermal expansion coefficient of the adhesive layer corresponding to one adhesive region is greater than that of another adhesive region... heating the adhesive layer such that a thermal expansion size of the adhesive layer corresponding to one adhesive region is greater than that corresponding to another adhesive region
Data Source
AI summary
A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.