Semiconductor Carrier Adhesive Layout for Fast LED Transfer
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Solution Overview
Problem
The existing process of transferring LEDs between substrates is time-consuming and prone to causing LEDs to skew or offset due to the heat generated during the etching process, which disrupts the manufacturing process and continuous processing.
Innovation Solution
A semiconductor device arrangement and manufacturing method involving a carrier with inclined adhesive portions that allow for efficient separation of LEDs using a laser lift-off process, eliminating the need for etching and reducing heat-related distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the etching process is used to remove the adhesive layer between adjacent LEDs, then the adhesive layer can be completely removed, but the processing time is extended and heat generation causes LEDs to skew or offset
Solution Approach 1:
The patent replaces the chemical etching process with a mechanical separation approach. The adhesive layer is designed with a predetermined separation line that allows for clean mechanical separation between adjacent LEDs, eliminating the need for time-consuming chemical etching while maintaining complete adhesive removal.
Solution Approach 2:
The adhesive layer is pre-configured with a predetermined separation line during the bonding process. This preliminary structuring of the adhesive layer enables direct mechanical separation without requiring subsequent etching steps, significantly reducing processing time while ensuring complete adhesive removal at the separation line.
2Manufacturing precision
If the etching process is used to remove the adhesive layer between adjacent LEDs, then the adhesive layer can be completely removed, but the manufacturing process becomes more complex
Solution Approach 1:
The adhesive layer is pre-configured with a predetermined separation line during the initial bonding process. This preliminary structuring eliminates the need for subsequent etching steps and complex process controls, simplifying the overall manufacturing process while ensuring complete adhesive removal at the separation line.
Solution Approach 2:
The patent replaces the complex chemical etching process with a simple mechanical separation approach. The predetermined separation line in the adhesive layer enables direct separation without requiring etching equipment, chemical handling, or complex process parameters, thereby reducing manufacturing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time and minimizes distortions, enabling more efficient and precise transfer of semiconductor devices without the need for etching, thus improving manufacturing efficiency and product quality.
Implementation Method 1
a laser lift-off process
Implementation Method 2
The etching process is then used to remove the adhesive layer
Data Source
AI summary
An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive portion, and a second adhesive portion. The first semiconductor device and the second semiconductor device are separately arranged on the carrier. The first adhesive portion and the second adhesive portion are separately arranged on the carrier, the first adhesive portion is located between the first semiconductor device and the carrier, and the second adhesive portion is located between the second semiconductor device and the carrier. In the cross-sectional view, the first adhesive portion includes an inclined sidewall, and the inclined sidewall is adjacent to the carrier and forms an interior angle greater than 90 degrees to the carrier.