Carrier Aggregation Phase Control for Band Isolation and Low Noise
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Solution Overview
Problem
Existing radio-frequency (RF) carrier aggregation systems face challenges in maintaining low noise figure and sufficient band isolation, especially when aggregating frequency bands that are close to each other, often requiring additional high-Q filters that increase cost and complexity.
Innovation Solution
A carrier aggregation (CA) circuit with a diplexer configuration that includes phase shifting circuits and switches, allowing for impedance matching and open-circuit conditions for non-target frequency bands, thereby improving noise figure performance without the need for additional high-Q filters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional high-Q filters are used to improve band isolation and noise figure, then isolation between frequency bands is improved, but device complexity and cost increase
Solution Approach 1:
The signal path is divided into separate first and second paths, each handling a specific frequency band. The first path processes the first frequency band while the second path processes the second frequency band, allowing independent optimization of each path without requiring additional high-Q filters for isolation.
Solution Approach 2:
Each path is configured with specific impedance characteristics tailored to its frequency band. The first path provides matched impedance for the first band and open-circuit impedance for the second band, while the second path provides matched impedance for the second band and open-circuit impedance for the first band, achieving band-specific optimization.
2Reliability
If additional high-Q filters are used to improve band isolation, then isolation between frequency bands is improved, but device complexity increases
Solution Approach 1:
The signal path is divided into separate first and second paths, each handling a specific frequency band. The first path processes the first frequency band while the second path processes the second frequency band, allowing independent optimization of each path without requiring additional high-Q filters for isolation.
Solution Approach 2:
Each path is configured with specific impedance characteristics tailored to its frequency band. The first path provides matched impedance for the first band and open-circuit impedance for the second band, while the second path provides matched impedance for the second band and open-circuit impedance for the first band, achieving band-specific optimization.
3Device complexity
If a common path is used for multiple frequency bands, then device complexity is reduced, but noise figure and band isolation deteriorate
Solution Approach 1:
The signal path is divided into separate first and second paths, each handling a specific frequency band. The first path processes the first frequency band while the second path processes the second frequency band, allowing independent optimization of each path without requiring additional high-Q filters for isolation.
Solution Approach 2:
The first and second paths are combined at a common output node, allowing the system to achieve the performance benefits of separate paths while maintaining a compact structure. The combined configuration enables carrier aggregation functionality without the full complexity of completely separate processing chains.
4Device complexity
If a common path is used for multiple frequency bands, then device complexity is reduced, but band isolation deteriorates
Solution Approach 1:
The signal path is divided into separate first and second paths, each handling a specific frequency band. The first path processes the first frequency band while the second path processes the second frequency band, allowing independent optimization of each path without requiring additional high-Q filters for isolation.
Solution Approach 2:
The first and second paths are combined at a common output node, allowing the system to achieve the performance benefits of separate paths while maintaining a compact structure. The combined configuration enables carrier aggregation functionality without the full complexity of completely separate processing chains.
Data Source
AI summary
Phase control for carrier aggregation. In some embodiments, a carrier aggregation circuit can include a first filter configured to allow operation in a first frequency band, and a second filter configured to allow operation in a second frequency band. The circuit can further include a first path implemented between the first filter and a common node, with the first path being configured to provide a substantially matched impedance for the first frequency band and a substantially open-circuit impedance for the second frequency band. The circuit can further include a second path implemented between the second filter and the common node, with the second path being configured to provide a substantially matched impedance for the second frequency band and a substantially open-circuit impedance for the first frequency band.


