Transparent Carrier Alignment Marks for Electronic Device Assembly
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Solution Overview
Problem
Existing methods for manufacturing electronic devices face challenges in achieving high process yield and reliability, particularly in the context of thinner and lighter devices with complex alignment and assembly processes.
Innovation Solution
A method involving the use of a transparent carrier with alignment marks and precise offset calculations to accurately position samples, followed by the formation of additional marks for improved alignment, and the application of dielectric and conductive layers to enhance manufacturing accuracy and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing methods are used for electronic devices, then the manufacturing process is simpler, but the process yield and reliability are lower
Solution Approach 1:
The method performs preliminary alignment mark formation and offset calculation before the main manufacturing process. By pre-establishing the reference marks and calculating positional offsets in advance, the system ensures accurate sample positioning without adding complexity to the subsequent manufacturing steps, thereby improving process yield while maintaining process simplicity
Solution Approach 2:
The invention replaces traditional mechanical alignment methods with an optical/mark-based alignment system. Instead of relying on mechanical fixtures and manual positioning, the system uses formed alignment marks and calculated offsets to determine sample position, achieving higher precision and reliability without significantly increasing manufacturing complexity
2Manufacturing precision
If alignment marks are used to improve positioning accuracy, then manufacturing precision is improved, but the risk of cracking and alignment errors increases
Solution Approach 1:
The system implements a feedback mechanism by calculating the offset between the formed alignment mark and the standard reference position. This offset information is then used to adjust the sample positioning, creating a closed-loop control system that compensates for alignment errors and prevents cracking, thereby improving manufacturing precision while eliminating the harmful effects of misalignment
Solution Approach 2:
The invention changes the parameter of alignment mark formation by using a controlled marking process that creates precise reference points. By carefully controlling the mark formation process and using these marks as references for offset calculation, the system achieves high alignment accuracy without introducing stress or defects that could lead to cracking
Data Source
AI summary
The disclosure provides a method of manufacturing an electronic device. The method of manufacturing the electronic device includes the following steps: providing a transparent carrier having an accommodation space, wherein the transparent carrier has a first mark; disposing a sample in the accommodation space of the transparent carrier, wherein the sample has a second mark; calculating an offset of the sample according to the first mark, the second mark, and a standard value; and forming a third mark on the sample or the transparent carrier according to the offset. The method of manufacturing of the electronic device of the disclosure may improve process yield or reliability.