Semiconductor Carrier Alignment via Light Absorption Notch

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Solution Overview

Problem

In semiconductor manufacturing processes, carriers need to be aligned without sustaining damage to allow for reusability, as existing marking methods can compromise the reliability and integrity of the carriers.

Innovation Solution

A light absorption layer is applied to the carrier, with a notch created by partially removing the layer at the periphery to allow light exposure for alignment, enabling precise alignment without physical marking and facilitating reuse by debonding the layer after processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If physical marking methods are used to align carriers, then alignment precision is improved, but carrier integrity and reliability deteriorate

Engineering Contradiction:

Improvealignment precisionVSAvoidcarrier reliability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent replaces physical/mechanical marking methods with an optical marking system. A light-absorbing layer is applied to the carrier surface, and light patterns are projected onto this layer to create optical alignment marks. These optical marks are detected by sensors without any physical contact or damage to the carrier, thus achieving precise alignment while maintaining carrier integrity and reusability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If carriers are marked using traditional methods, then alignment is achieved, but carrier damage increases reducing reusability

Engineering Contradiction:

Improvealignment capabilityVSAvoidcarrier reusability

Core Design Contradiction:

Ease of operationVSDuration of action of stationary object

Solution Approach 1:

Traditional mechanical marking methods that physically alter the carrier are replaced with an optical field-based marking system. Light patterns are used to create temporary visual marks on a light-absorbing layer, which can be detected by alignment sensors and then removed or the layer can be peeled off, leaving the carrier undamaged and reusable for multiple cycles.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The light-absorbing layer serves as a temporary, disposable component that can be applied to the carrier for alignment marking purposes and then removed or peeled off after use. This allows the carrier itself to be recovered and reused multiple times without accumulating damage from repeated marking operations, while the marking function is still achieved during each use cycle.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for precise alignment of carriers without damaging them, ensuring their reliability and reusability in multiple semiconductor manufacturing processes, reducing material waste and maintaining carrier robustness.

Implementation Method 1

A light absorption layer is applied to the carrier, with a notch created by partially removing the layer at the periphery to allow light exposure for alignment

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS9922934B2Semiconductor manufacturing process and package carrier

Publication Date: 2018.03.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.