Component Carrier Anchoring Interface Prevents Delamination
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Solution Overview
Problem
Component carriers with embedded components face issues of delamination and warpage due to the limitations of conventional adhesive materials, which compromise mechanical and electrical reliability, especially under harsh conditions.
Innovation Solution
A component carrier design featuring a stack with a cavity lined by a first polymer and an embedded component covered by a second polymer, forming a mechanical anchoring interface through interdiffusion or autohesion, which provides a soft and stable connection without covalent bonds, enhancing mechanical properties and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive materials are used to bond components in component carriers, then components can be mounted and connected, but delamination and warpage occur compromising mechanical and electrical reliability
Solution Approach 1:
The patent changes the bonding mechanism from conventional adhesive bonding to mechanical interlocking through anchor structures. The anchor structures protrude into the cavity and physically interlock with the component, transforming the bonding principle from chemical adhesion to mechanical engagement, thereby eliminating delamination and warpage issues
Solution Approach 2:
The patent replaces the chemical bonding system (adhesives) with a mechanical bonding system (anchor structures). The anchors physically engage with the component through interlocking geometries, substituting the adhesive layer with a mechanical fastening mechanism that provides superior reliability under thermal and mechanical stress
2Strength
If rigid adhesive bonds are used to fix components, then strong mechanical connection is achieved, but flexibility and stress buffering are reduced
Solution Approach 1:
The patent segments the bonding function into multiple discrete anchor structures distributed across the component interface. Instead of a continuous rigid adhesive layer, multiple individual anchors provide localized mechanical interlocking, allowing the component to flex and move slightly between anchor points while maintaining overall structural integrity
Solution Approach 2:
The patent creates a composite bonding system combining rigid anchor structures with the surrounding cavity material. The anchors provide strong mechanical interlocking while the cavity material (such as epoxy or polymer) fills the spaces between anchors, creating a composite structure that combines the strength of mechanical interlocking with the flexibility of the matrix material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents delamination and warpage by creating a flexible, stress-buffering interface that maintains mechanical and thermal reliability, extending the lifespan of bonding joints and allowing for a more flexible design, while avoiding the drawbacks of conventional adhesive use.
Implementation Method 1
forming a mechanical anchoring interface through interdiffusion or autohesion
Implementation Method 2
forming a mechanical anchoring interface through interdiffusion or autohesion
Data Source
AI summary
A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.