Multilayer Carrier Anchoring Structures for Semiconductor Stability
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Solution Overview
Problem
Conventional devices with multilayer carriers suffer from inadequate mechanical stability due to poor adhesion between layers, which can lead to detachment under external forces or thermal influences.
Innovation Solution
A device with a carrier comprising multiple layers, including a metal layer for electrical contacting, an insulating layer for electrical insulation, and a molding layer for mechanical anchoring, featuring internal anchoring structures such as projections and recesses that form a form-locked connection to enhance adhesion and stability, particularly in the vertical direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional multilayer carrier structures are used, then the device can be manufactured with standard processes, but the mechanical stability is inadequate due to poor adhesion between layers
Solution Approach 1:
Anchoring structures are formed in the carrier before the layers are applied, creating pre-prepared engagement features that will later lock the layers together. This preliminary formation of mechanical interlocks resolves the adhesion problem by providing physical anchoring points before layer deposition occurs.
Solution Approach 2:
The anchoring structures extend in the vertical dimension (perpendicular to the layer planes), creating form-locked connections that prevent layer detachment. By adding this vertical mechanical interlocking dimension to the otherwise planar layer structure, the patent significantly improves mechanical stability and inter-layer adhesion.
2Stability of the object's composition
If layers are bonded with strong adhesion, then mechanical stability improves, but the manufacturing process becomes more complex
Solution Approach 1:
The anchoring structures are formed as integral parts of the carrier using the same standard semiconductor manufacturing processes, requiring no additional specialized equipment or complex steps. The carrier itself provides the anchoring function, making the system self-sufficient and avoiding increased manufacturing complexity.
3Reliability
If anchoring structures are added to the carrier, then layer adhesion improves, but the carrier manufacturing becomes more complex
Solution Approach 1:
The anchoring structures are integrated into the carrier fabrication process itself, combining the carrier formation and anchoring structure creation into a single unified manufacturing step. This merging eliminates the need for separate anchoring structure fabrication, maintaining ease of manufacture while providing improved layer adhesion.
Data Source
AI summary
A device and a method for producing a device are disclosed. In an embodiment the device includes a carrier and a semiconductor body arranged in a vertical direction on the carrier. The carrier includes at least one metal layer for electrically contacting the semiconductor body, a non-metallic molding layer, at least one electrically insulating insulation layer, wherein the insulation layer is arranged in the vertical direction between the semiconductor body and the molding layer and internal anchoring structures, wherein at least two layers of the metal layer, the molding layer and the insulation layer are anchored to one another by the internal anchoring structures.