Carrier Aperture Formation with Simultaneous Oxidation
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Solution Overview
Problem
Conventional methods for producing semiconductor devices are complex and yield unreliable results due to low efficiency in creating apertures and electrically connecting opposite faces of carriers.
Innovation Solution
A method involving a heater to create apertures in a carrier in an oxygen-rich environment, forming a silicon dioxide isolative layer simultaneously, and filling the aperture with a conductive material for reliable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to make apertures and provide isolative layers separately, then the process is well-established, but the manufacturing complexity increases and yield decreases
Solution Approach 1:
The patent combines the aperture formation process and the isolative layer formation process into a single integrated step. The isolative layer is formed simultaneously with aperture creation through a coating process applied during or immediately after aperture formation, eliminating the need for separate processing steps and reducing overall manufacturing complexity.
Solution Approach 2:
The isolative layer is formed in advance during the aperture creation process itself, rather than as a subsequent separate step. This preliminary action ensures that the isolative layer is already in place before final assembly, improving reliability by preventing short circuits and reducing the number of subsequent processing steps required.
2Productivity
If multiple separate steps are used for aperture making and isolative layer provision, then each step can be optimized independently, but the overall production time increases
Solution Approach 1:
The patent merges aperture formation and isolative layer deposition into a single integrated process step. The isolative layer is applied concurrently with aperture creation through a coating mechanism, eliminating the sequential time required for separate processing steps and significantly improving production efficiency.
Solution Approach 2:
The process maintains continuous useful action by forming the isolative layer during the aperture creation process itself, rather than pausing for separate processing. This continuous operation eliminates idle time between steps and maximizes productivity by ensuring that material and equipment remain actively engaged in value-added operations throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process, enhances reliability, and ensures efficient electrical connectivity between the carrier's opposite faces, improving the overall semiconductor device production.
Implementation Method 1
a heater is provided for heating a portion of the carrier in an environment rich in oxygen, thus making an aperture in the carrier and forming an isolative layer on the wall of the aperture synchronously
Data Source
AI summary
Disclosed is a method for making an aperture in a carrier and electrically connecting two opposite faces of the carrier. At first, a carrier is provided. Secondly, a heater is provided for heating a portion of the carrier in an environment rich in oxygen, thus making an aperture in the carrier and forming an isolative layer on the wall of the aperture synchronously. Finally, the aperture is filled with a conductive material.