Carrier-attached ultra-thin copper foil release layer
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Solution Overview
Problem
Conventional carrier-attached ultra-thin copper foils face challenges in controlling the peeling strength due to uneven thickness and ingredient content distribution in the release layer, leading to inconsistent performance in printed circuit board fabrication.
Innovation Solution
A method for producing a carrier-attached ultra-thin copper foil involves forming a release layer with a copper-containing organic compound having a copper-nitrogen bond on the copper foil carrier, which allows for the separation of the copper foil carrier from the ultra-thin copper foil layer with controlled peeling strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a release layer is deposited on the copper foil carrier through electroplating, then the release layer can be formed, but the thickness and ingredient content distribution become uneven
Solution Approach 1:
The patent changes the chemical composition parameters of the release layer by incorporating organic compounds (such as fatty acids, soap, or resin) alongside inorganic compounds. This compositional parameter change enables more uniform thickness and ingredient content distribution compared to traditional electroplating alone, while maintaining ease of manufacture.
Solution Approach 2:
The release layer is designed as a composite material combining inorganic compounds (such as metal oxides or hydroxides) with organic compounds (fatty acids, soap, or resin). This composite structure achieves both uniform distribution properties and effective release functionality, resolving the contradiction between ease of manufacture and manufacturing precision.
2Reliability
If the release layer composition is varied to control peeling strength, then peeling strength control improves, but the complexity of the release layer increases
Solution Approach 1:
The patent controls peeling strength by adjusting parameters such as the thickness of the release layer and the specific composition ratios of organic to inorganic compounds. By systematically varying these parameters within defined ranges, reliable peeling strength control is achieved without unnecessarily increasing compositional complexity.
Solution Approach 2:
The release layer composition is optimized for its specific function of controlling peel strength between the copper foil carrier and the copper foil. The organic compounds (fatty acids, soap, or resin) combined with inorganic compounds provide the necessary local quality for controlled release, maintaining compositional simplicity where possible.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively improves the control over peeling strength between the copper foil carrier and the ultra-thin copper foil layer, addressing the issues of non-uniform thickness and content distribution in the release layer, thereby enhancing the reliability and consistency of printed circuit board fabrication.
Implementation Method 1
a chemical structure of the copper-containing organic compound has at least a copper-nitrogen bond (Cu—N bond)
Implementation Method 2
The release layer is formed on the copper foil carrier through electroplating
Data Source
AI summary
A carrier-attached ultra-thin copper foil and a method for producing the same are provided. The carrier-attached ultra-thin copper foil includes a copper foil carrier, a release layer, and an ultra-thin copper foil layer. The release layer is formed on a side surface of the copper foil carrier. The release layer contains a copper-containing organic compound, and a chemical structure of the copper-containing organic compound has at least a copper-nitrogen bond (Cu—N bond). The ultra-thin copper foil layer is formed on a side surface of the release layer away from the copper foil carrier. The copper foil carrier is capable of being separated from the ultra-thin copper foil layer through the release layer.