Carrier Base Material-Added Wiring Substrate Warping
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Solution Overview
Problem
The increased density of semiconductor elements on wiring substrates leads to deformation issues during assembly, causing connection failures and damage due to the warping of coreless wiring substrates, which are difficult to handle and assemble effectively.
Innovation Solution
A carrier base material-added wiring substrate structure is introduced, comprising a first carrier base material adhered to the wiring substrate, a second carrier base material arranged within an opening of the first, and a third carrier base material covering the opening, providing support and stability to limit warping and facilitate handling and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a coreless wiring substrate is used to reduce thickness and increase wiring density, then the substrate becomes thinner and allows higher wiring density, but the substrate becomes more prone to warping and deformation during manufacturing and assembly
Solution Approach 1:
The carrier base material is divided into multiple segments: a first carrier base material with an opening exposing the product area, a second carrier base material arranged in the opening, and a third carrier base material covering the opening. This segmentation provides distributed support to the coreless wiring substrate, preventing warping while maintaining thinness and high wiring density.
2Volume of moving object
If a coreless wiring substrate is used to reduce thickness, then the substrate becomes thinner, but the substrate becomes difficult to handle during manufacturing and assembling processes
Solution Approach 1:
The multi-segment carrier base material acts as an intermediary between the thin coreless wiring substrate and the handling/assembly processes. The carrier provides mechanical support and stability, making the thin substrate easy to handle during manufacturing and assembly without requiring changes to the substrate itself.
3Stability of the object's composition
If a tentative substrate is used to support the wiring substrate during assembly, then the wiring substrate stability is improved, but deformation may still cause connection failure or damage
Solution Approach 1:
The carrier base material is configured with different regions having different properties: the first carrier base material with an opening provides support while exposing the product area for electrical tests; the second carrier base material in the opening provides localized support under the product area; the third carrier base material covers the opening to provide overall support. This local quality differentiation stabilizes the substrate while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces deformation and enhances the reliability of connections between semiconductor elements and the wiring substrate, minimizing damage and failure by stabilizing the substrate during assembly and testing processes.
Implementation Method 1
The first carrier base material is adhered by a first adhesive layer to a lower surface of the wiring substrate
Implementation Method 2
The third carrier base material is adhered by a second adhesive layer to the first carrier base material and the second carrier base material
Data Source
AI summary
A carrier base material-added wiring substrate includes a wiring substrate and first to third carrier base materials. The first carrier base material is adhered by a first adhesive layer to a lower surface of the wiring substrate and includes an opening that exposes a product area of the wiring substrate. The second carrier base material is arranged in the opening of the first carrier base material and contacts the lower surface of the wiring substrate. The third carrier base material is adhered by a second adhesive layer to the first carrier base material and the second carrier base material. The third carrier base material covers the opening of the first carrier base material. The second adhesive layer is formed entirely on an upper surface of the third carrier base material.