Carrier Base Material Wiring Substrate Probe Access
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Solution Overview
Problem
The challenge is to conduct electrical tests on wiring substrates with increased semiconductor element density, where external connection terminals are covered by a tentative substrate, making it difficult for test probes to contact them.
Innovation Solution
A carrier base material-added wiring substrate is created by adhering a carrier base material with an adhesive layer to the solder resist layer, forming openings that expose external connection terminals, allowing probe contact for electrical testing, with the carrier base material's openings being smaller than those of the solder resist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a coreless wiring substrate is used to reduce thickness and increase wiring density, then the substrate becomes thinner and can accommodate higher wiring density, but the substrate becomes more prone to warping and harder to handle during manufacturing and assembling
Solution Approach 1:
A carrier base material is introduced as an intermediary support structure during the manufacturing process. The wiring substrate is formed on this carrier, which provides mechanical support and prevents warping. After manufacturing, the carrier is removed, leaving the thin coreless wiring substrate with its required flexibility and density.
Solution Approach 2:
The carrier base material is attached in advance during the manufacturing process to provide support when the wiring substrate is most vulnerable to warping. This preliminary support is removed after the wiring patterns are completed, allowing the substrate to achieve its final thin, flexible state.
2Ease of operation
If a rigid tentative substrate is used to support the wiring substrate during manufacturing, then the wiring substrate can be handled more easily, but the external connection terminals become covered and inaccessible for electrical testing
Solution Approach 1:
The carrier base material is designed with local openings at specific positions where external connection terminals are located. This allows the carrier to provide overall support while locally exposing the terminals for electrical testing. The openings are strategically positioned to maintain both handleability and testability.
3Ease of operation
If the carrier base material openings are made larger to facilitate probe contact, then test probes can easily reach the external connection terminals, but the solder resist layer may be damaged
Solution Approach 1:
The carrier base material has openings with specific dimensions that are optimized to provide just enough clearance for probe insertion while maintaining protection for the solder resist layer. The opening size is carefully controlled to balance accessibility with protection.
Solution Approach 2:
The carrier base material acts as a protective cushion between the probe and the solder resist layer. Even when probes are inserted through the openings, the carrier material provides a buffer that prevents direct contact between the probe and the delicate solder resist, preventing damage before it can occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration facilitates easy insertion and contact of test probes with external connection terminals, enabling effective electrical testing and reducing the risk of damaging the solder resist layer, while also simplifying the manufacturing process by eliminating the need for removing and re-adhering the carrier base material.
Implementation Method 1
The carrier base material is adhered by an adhesive layer to the solder resist layer
Data Source
AI summary
A carrier base material-added wiring substrate includes a wiring substrate and a carrier base material. The wiring substrate includes an insulation layer, a wiring layer arranged on a lower surface of the insulation layer, and a solder resist layer that covers the lower surface of the insulation layer and includes an opening that exposes a portion of the wiring layer as an external connection terminal. The carrier base material is adhered by an adhesive layer to the solder resist layer. The carrier base material includes an opening that is in communication with the opening of the solder resist layer and exposes the external connection terminal. The opening of the carrier base material has a diameter that is smaller than that of the opening of the solder resist layer.