Carrier Board Support Bumps for Molding Pressure and Pad Cleanliness
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Solution Overview
Problem
Conventional semiconductor package carrier boards face issues with deformation and micro-cracks during molding due to excessive pressure, leading to adhesive material overflow and contamination of solder pads, which compromises the reliability of the soldering state inspection.
Innovation Solution
The semiconductor package carrier board structure features a design with supporting bumps that divide the conventional groove into two openings, providing structural strengthening and reducing the groove space, allowing the carrier board to withstand high molding pressures without deformation and preventing adhesive material overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the strip-shaped substrate is made extremely thin to reduce size, then the package size is reduced, but the substrate collapses and deforms under injection pressure during molding
Solution Approach 1:
The groove is divided into multiple sub-grooves by adding partition walls, creating a segmented structure that provides internal support to the thin substrate. This segmentation prevents the substrate from collapsing under injection pressure while maintaining the thin profile for compact packaging.
Solution Approach 2:
The partition walls are strategically positioned within the groove to provide localized structural reinforcement. This local quality enhancement strengthens the substrate at critical points without increasing the overall package size, allowing the thin substrate to withstand molding pressure.
2Volume of stationary object
If the groove space is large to accommodate components, then component placement is easier, but adhesive material infiltrates from the molding layer and contaminates the solder pads
Solution Approach 1:
The groove is segmented into multiple sub-grooves by partition walls, creating physical barriers that prevent adhesive material from flowing laterally across the groove. This segmentation contains the adhesive within smaller spaces and prevents it from reaching the solder pads, eliminating contamination while maintaining adequate groove volume.
Solution Approach 2:
The partition walls act as intermediary structures between the groove and the solder pads. These walls block the path of adhesive infiltration, serving as a protective barrier that prevents harmful adhesive material from reaching the critical solder pad areas.
3Ease of manufacture
If the groove structure is simplified for ease of manufacture, then manufacturing cost is reduced, but the carrier board deforms and develops micro-cracks under molding pressure
Solution Approach 1:
The groove is divided into sub-grooves using partition walls that can be formed through standard PCB manufacturing processes. This segmented structure enhances reliability by preventing deformation and micro-cracks under molding pressure, while the partition walls themselves are manufactured using conventional techniques, maintaining ease of manufacture.
4Measurement precision
If the semi-groove structure is formed to inspect solder filleting, then soldering quality is verified, but adhesive material blocks the filleting path and obscures the inspection function
Solution Approach 1:
The groove is segmented into sub-grooves by partition walls, creating a structured layout that directs adhesive flow into specific areas. This segmentation ensures that adhesive material does not block the semi-groove regions where solder filleting inspection occurs, maintaining clear visibility and access for quality verification.
Solution Approach 2:
The partition walls are strategically positioned to create zones of different functionality: areas adjacent to solder pads maintain the semi-groove structure for inspection, while other areas contain the full groove structure for component placement. This local quality differentiation ensures both inspection accuracy and proper adhesive containment.
Data Source
AI summary
A semiconductor package carrier board structure includes a plurality of carrier board bodies and a plurality of supporting bumps. The carrier board body includes a build-up circuit structure and a plurality of conductive blocks bonded to the build-up circuit structure. Adjacent ones of the carrier board bodies are connected to each other with their corresponding conductive blocks. An area formed by the adjacent conductive blocks defines a cutting path. An opening is formed on a surface of each of the conductive blocks at the cutting path. The supporting bumps are erected between the adjacent openings. As such, each of the supporting bumps corresponds to a position overlapping the cutting path to provide the support function of the semiconductor package carrier board structure when performing the semiconductor packaging operation. After performing the singulation operation, the supporting bumps can be completely removed and one side of the openings can be exposed.