Conductor Body Encapsulation Using a Carrier Body for Precise Positioning
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Solution Overview
Problem
Existing methods for producing components with electrically conductive conductor bodies face challenges in achieving defined shapes and orientations, requiring significant technical effort and often using complex and costly materials.
Innovation Solution
A method involving a carrier body that receives and modifies the conductor body, allowing partial or complete encapsulation with injection-molding material to form an integrally bonded component, optimizing the conductor body's shape and positioning for efficient electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the conductor body is directly encapsulated with injection-molding material, then the production process is simple, but the conductor body cannot achieve defined shape and orientation
Solution Approach 1:
A carrier body is introduced as an intermediary element between the conductor body and the injection-molding material. The carrier body receives the conductor body in a receiving region and is subsequently encapsulated by the injection-molding material, which bonds integrally to both the carrier body and conductor body, thereby achieving defined shape and orientation without direct complex positioning of the conductor body
Solution Approach 2:
The conductor body is received and positioned on the carrier body before the encapsulation process. This preliminary positioning action allows the conductor body to be placed in the correct orientation and shape definition prior to the injection-molding process, simplifying the overall production process while achieving precise geometric definition
2Manufacturing precision
If complex materials are used for the conductor body to achieve defined shape, then the shape definition is improved, but the production cost increases
Solution Approach 1:
The carrier body serves as a cost-effective intermediary that provides the geometric definition and shape constraints. Instead of using complex or expensive conductor body materials to achieve shape definition, the simple carrier body structure defines the shape, while the injection-molding material provides the structural integrity, thereby reducing production costs while maintaining manufacturing precision
3Reliability
If the conductor body is fully encapsulated to protect it, then the protection is improved, but the conductor body loses freedom of movement and positioning adjustment
Solution Approach 1:
The carrier body acts as a mediator that allows the conductor body to be received and positioned within a receiving region. This arrangement provides protection through integral bonding with the injection-molding material while maintaining the conductor body's positioning flexibility, as the carrier body can be designed with appropriate receiving regions that accommodate positioning requirements
Data Source
AI summary
Method for producing a component provided with at least one electrically conductive conductor body, wherein the conductor body is surrounded at least in portions, in particular largely, in an integrally bonded and/or interlocking fashion by an injection-molded body formed from an injection-molding material. The method includes receiving the conductor body at least in portions in or on a receiving region of a carrier body, the receiving region delimiting a receiving space. The method also includes encapsulating the carrier body, provided with the conductor body, at least in portions with the injection-molding material to form a component comprising at least the conductor body, the carrier body and the injection-molded body.