Semiconductor Carrier Break Nuclei for Clean Chip Singulation

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Solution Overview

Problem

Existing methods for singulating semiconductor components are inefficient and often result in material residues that can lead to short circuits and leakage currents, complicating the production of semiconductor components with predefinable sizes and efficient operation.

Innovation Solution

A method involving the creation of a break nucleus on a carrier by etching, which defines the position for singulation, allowing for the efficient separation of semiconductor components without chemical cleaning or material residue removal, thereby avoiding short circuits and enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional singulation methods are used, then semiconductor components can be separated, but material residues remain that cause short circuits and leakage currents

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidmaterial residues

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The patent divides the carrier into individual component carriers by etching break nuclei that extend through the carrier thickness. These break nuclei create predefined separation planes that guide the breaking process, ensuring clean separation without material residues that could cause electrical faults.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The break nuclei are etched into the carrier before the actual breaking process. This preliminary action creates predetermined weak points that guide where the carrier will break, ensuring that the separation occurs along clean, residue-free paths rather than creating unpredictable fracture surfaces with material residues.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If conventional singulation methods are used, then components can be separated, but the process is inefficient and complex

Engineering Contradiction:

Improvesingulation efficiencyVSAvoidprocess complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The method segments the singulation process into two clear stages: first etching multiple break nuclei in parallel across the carrier, then breaking the carrier along these predefined paths. This segmentation allows for efficient batch processing of multiple components simultaneously while maintaining simple, repeatable steps.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The break nuclei serve multiple functions: they define the separation path, guide the breaking process, and ensure clean separation surfaces. This multi-functionality reduces the need for additional process steps such as chemical cleaning or surface preparation, thereby simplifying the overall process while maintaining high productivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If break nuclei extend deeply through the carrier, then singulation is cleaner, but etching time and complexity increase

Engineering Contradiction:

Improvesingulation precisionVSAvoidetching time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The break nuclei are etched to extend through the entire thickness of the carrier, creating a localized region of reduced material strength that spans the full depth. This localized through-etching ensures precise break paths without requiring excessive etching depth beyond what is necessary to penetrate the carrier, optimizing both precision and time efficiency.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the singulation process, reduces material residues, and improves the stability and operational efficiency of semiconductor components, enabling them to be operated at high power levels with reduced risk of leakage currents and short circuits.

Implementation Method 1

at least one break nucleus is etched at a side of the carrier facing the semiconductor chips... To form the break nucleus, material of the carrier or the semiconductor chips can be removed by etching

Methodology Applied

Scientific EffectEtching:

Data Source

PatentUS11837844B2Method for manufacturing optoelectric semiconductor component and optoelectric semiconductor component device

Publication Date: 2023.12.05 AMS OSRAM INT GMBH

AI summary

A method for singulating semiconductor components (20) is specified, said method comprising the steps of providing a carrier (21), applying at least two semiconductor chips (22) on the carrier (21), etching at least one break nucleus (23) at a side of the carrier (21) facing the semiconductor chips (22), and singulating at least two semiconductor components (20) by breaking the carrier (21) along the at least one break nucleus (23). The at least one break nucleus (23) extends at least in places in a vertical direction (z), the vertical direction (z) being perpendicular to a main extension plane of the carrier (21), and the at least one break nucleus (23) is arranged between the two semiconductor chips (22) in a lateral direction (x), the lateral direction (x) being parallel to the main extension plane of the carrier (21). Further, each of the semiconductor components (20) comprises at least one of the semiconductor chips (22), and the expansion of the at least one break nucleus (23) in the vertical direction (z) is at least 1% of the expansion of the carrier (21) in the vertical direction (z). Furthermore, a semiconductor component (20) is specified.