Component Carrier Cap Structure for Signal Integrity
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Solution Overview
Problem
Conventional component carriers face challenges in maintaining signal integrity and size reduction, particularly in RF modules and 5G applications, where shields made of prefabricated metal sheets increase size and can only be mounted on specific areas, complicating manufacturing and increasing costs.
Innovation Solution
A component carrier with a laminated stack of conductive and insulating layers, featuring a cap structure that selectively covers an optical waveguide on its exterior surface, allowing for flexible placement and omission of separate metal shielding, manufactured using methods like plating, sputtering, lithography, and 3D printing, using materials such as metals or organic polymers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shields made of prefabricated metal sheets are surface-mounted to cover and shield the traces, then signal integrity is improved, but the size of the component carrier is increased
Solution Approach 1:
The patent merges the shielding function with the existing cap structure that covers the optical waveguide. Instead of adding separate metal shields, the cap structure is integrated to provide both mechanical protection and electromagnetic shielding by incorporating conductive material or conductive coating layers within the cap structure itself.
Solution Approach 2:
The cap structure is designed to serve multiple functions simultaneously: it provides mechanical protection for the optical waveguide, electromagnetic shielding for the traces, and structural support. This multi-functionality eliminates the need for separate shielding components, thereby maintaining compact size while improving signal integrity.
2Reliability
If shields made of prefabricated metal sheets are surface-mounted in a separate manufacturing step, then shielding is achieved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The shielding function is merged into the cap structure manufacturing process. The cap structure is formed using existing manufacturing techniques (molding, 3D printing, or laminating) with conductive materials or coatings, eliminating the need for a separate shield mounting step and reducing manufacturing complexity.
Solution Approach 2:
The shielding capability is built into the cap structure during its formation, before final assembly. By incorporating conductive material or applying conductive coatings during cap structure manufacturing, the shielding function is prepared in advance, eliminating subsequent assembly steps and simplifying the overall manufacturing process.
3Reliability
If shields are surface-mounted by a mounting machine, then shielding is provided, but the manufacturing efficiency is reduced due to additional assembly steps
Solution Approach 1:
The shielding function is combined with the cap structure, which is already part of the standard manufacturing process. This integration eliminates the need for separate shield mounting operations, thereby improving manufacturing efficiency while maintaining adequate shielding coverage for critical areas.
Solution Approach 2:
Instead of providing complete shielding across the entire component carrier, the cap structure provides shielding coverage for the specific areas where it is mechanically present (over the optical waveguide and adjacent traces). This partial shielding approach achieves sufficient protection for critical signals while avoiding the complexity and inefficiency of full-coverage shields.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies manufacturing, reduces costs, and enhances signal integrity by allowing the cap structure to be placed anywhere on the carrier, providing effective shielding and mechanical protection while maintaining a compact size, thus improving performance in high-frequency applications.
Implementation Method 1
a cap structure selectively covering an optical waveguide at an exterior surface of the laminated stack
Implementation Method 2
the cap structure may comprise or consist of material layers arranged one layer on top of another layer... a layer comprising inorganic material and a further layer comprising organic material may be located next to the other respective layer, while having direct contact
Data Source
AI summary
A component carrier includes a laminated stack having electrically insulating layer structures and electrically conductive layer structures; and an electrically insulating cap structure selectively covering an optical waveguide at an exterior surface of the laminated stack. A method for manufacturing a component carrier is also disclosed.