Semiconductor Carrier Cleaning with Nanobubble Washing and Vacuum Drying
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Solution Overview
Problem
Conventional cleaning methods for semiconductor carriers are inefficient, require multiple workstations, and fail to effectively remove volatile organic compounds and contaminants like toluene and isopropanol, leading to prolonged operation times and increased space requirements.
Innovation Solution
A one-stop cleaning method and system that includes disassembly, classification, nanobubble washing, and negative pressure vacuum drying, utilizing deionized water mixed with carbon dioxide, ozone, or ammonia, with ultrasonic vibration and heating, to clean semiconductor carriers comprehensively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning methods use multiple workstations for different functions, then cleaning coverage is comprehensive, but operation time and space requirements increase
Solution Approach 1:
The patent combines multiple cleaning functions (rinsing, ultrasonic cleaning, heating, drying) into a single integrated workstation. The cleaning system includes a rinsing tank, ultrasonic cleaning tank, heating device, and drying device all arranged in one station, eliminating the need to move carriers between multiple workstations and reducing total operation time while maintaining comprehensive cleaning coverage
Solution Approach 2:
The single workstation is designed to perform multiple functions simultaneously or sequentially on the same carrier. The system can rinse, ultrasonically clean, heat, and dry semiconductor carriers within one station, making the workstation universal and eliminating the need for specialized separate stations for each function
2Reliability
If conventional cleaning methods use multiple workstations for different functions, then cleaning coverage is comprehensive, but equipment space increases
Solution Approach 1:
The patent combines multiple cleaning functions (rinsing, ultrasonic cleaning, heating, drying) into a single integrated workstation. The cleaning system includes a rinsing tank, ultrasonic cleaning tank, heating device, and drying device all arranged in one station, eliminating the need to move carriers between multiple workstations and reducing total operation time while maintaining comprehensive cleaning coverage
Solution Approach 2:
The single workstation is designed to perform multiple functions simultaneously or sequentially on the same carrier. The system can rinse, ultrasonically clean, heat, and dry semiconductor carriers within one station, making the workstation universal and eliminating the need for specialized separate stations for each function
3Device complexity
If deionized water rinsing followed by drying is used, then the process is simple, but cleaning effectiveness is limited and harmful gas residuals remain
Solution Approach 1:
The patent introduces ultrasonic vibration into the cleaning process. The ultrasonic cleaning tank generates high-frequency vibrations that create cavitation bubbles in the cleaning fluid, which implode to physically remove contaminants from carrier surfaces and components, significantly improving cleaning effectiveness over simple rinsing while maintaining reasonable process complexity
Solution Approach 2:
The patent changes the parameters of the cleaning process by introducing heating. The heating device raises the temperature of the cleaning fluid, which enhances the removal of organic contaminants and volatile compounds through increased molecular activity and improved solvent effectiveness, thereby improving cleaning effectiveness while keeping the process integrated and manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cleaning efficiency by removing contaminants and volatile organic compounds, reduces space and operation time, and ensures high cleanliness levels by integrating cleaning, heating, drainage, and drying processes in a single system.
Implementation Method 1
a nanobubble washing step of cleaning the components in the individual cleaning chambers by the individual cleaning chambers according to cleaning processes set according to characteristics of the components to be cleaned
Implementation Method 2
the cleaning chamber is provided with an ultrasonic vibration device, and the cleaning fluid in the cleaning chamber is stirred by generating high-frequency sound wave vibration to clean the component by means of performing ultrasonic vibration
Implementation Method 3
the cleaning chamber is provided with a heating device for heating the cleaning fluid in the cleaning chamber
Implementation Method 4
a negative pressure vacuum drying step of drying the components inside the individual cleaning chambers by the individual cleaning chambers
Data Source
AI summary
A one-stop cleaning system and method for a semiconductor carrier. The method includes steps of disassembly, classification, nanobubble washing and negative pressure vacuum drying. The system includes multiple cleaning chambers, a nanobubble generator, a drainage device, and a negative pressure vacuum drying device. With one-stop integration of the steps of disassembly, classification, nanobubble washing and negative pressure vacuum drying, contaminants and organic compounds of a semiconductor carrier can be effectively removed to provide application suitability for cleaning a semiconductor carrier.