Component Carrier Cluster Insertion for Warpage Control
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Solution Overview
Problem
Conventional fan-out wafer level packaging (FOWLP) processes face challenges with warpage and yield drop due to core usage during high-volume manufacturing (HVM) processes.
Innovation Solution
A method and component carrier design where a cluster of stacked and connected components is inserted into a cavity, ensuring a height difference of less than 15 µm between opposing lateral sidewalls, thereby improving planarity and avoiding warpage, and utilizing a thicker cluster than traditional cores to enhance manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a core is used in conventional FOWLP processes, then the package structure is formed, but warpage occurs and yield drops during HVM manufacturing
Solution Approach 1:
The method performs preliminary actions by stacking and connecting components to form a complete cluster before inserting it into the cavity. This preliminary formation of the cluster with controlled height difference prevents warpage during subsequent HVM processes, thereby improving yield and maintaining planarity throughout manufacturing
Solution Approach 2:
The invention changes the critical parameter of height difference control to less than 15 μm between opposing lateral sidewalls of the cluster. This parameter control is achieved through the stacking and connecting process before cavity insertion, resolving the warpage issue while maintaining manufacturing reliability
2Stability of the object's composition
If a thicker cluster is used instead of a traditional core, then planarity and warpage control are improved, but the manufacturing process complexity increases
Solution Approach 1:
The invention merges multiple components into a single stacked cluster structure with controlled height difference. This merging approach simplifies the overall manufacturing process by treating the cluster as one unit for cavity insertion, while simultaneously achieving improved planarity and warpage control through the integrated stacking design
Data Source
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AI summary
According to the present invention, a method of manufacturing a component carrier (1) comprises a step of stacking and connecting a first component (2) and a second component (3) to one another to form a cluster (2, 3) and thereafter, a step of inserting the cluster (2, 3) into a cavity (4) of a base structure (5). A component carrier (1) comprises a base structure (5) having a cavity (4); a cluster (2, 3) comprising a first component (2) stacked and connected with a second component (3), wherein the cluster (2, 3) is arranged in the cavity (4). A height difference between opposing lateral sidewalls of the cluster (2, 3) is less than 15 µm.