Carrier Crack Structure for Ultra-Thin Die Dicing

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Solution Overview

Problem

Conventional dicing methods for ultra-thin dies face challenges such as sidewall damage during mechanical dicing, reduced die strength from laser ablation, and complexity in integrating backside metallization with plasma dicing, which can lead to metal contamination and difficulties in backside patterning.

Innovation Solution

A method involving the formation of an arrangement of defects in the carrier to generate a crack structure, partial removal of the carrier to expose the surface region, and separation of the surface region into portions along the crack structure, allowing for efficient dicing while avoiding metal contamination and enabling backside metallization without topological complications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical dicing is used for ultra-thin dies, then the dicing process can be performed, but sidewall damage occurs

Engineering Contradiction:

Improvedicing process capabilityVSAvoidsidewall integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical dicing with a combination of laser-induced crack formation and mechanical breaking. Lasers create predefined crack structures in the carrier substrate, which then guide the breaking process to separate dies without mechanical contact with the die sidewalls, eliminating sidewall damage while maintaining dicing capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent performs preliminary laser treatment to create crack structures in the carrier substrate before the actual die separation. These pre-formed cracks serve as guided paths for subsequent breaking, ensuring clean separation without mechanical contact with the ultra-thin dies, thus preserving sidewall integrity

Inventive Principle:

Principle #10Preliminary action

2Productivity

If laser ablation dicing is used for ultra-thin dies, then the dicing process can be performed, but die strength is reduced

Engineering Contradiction:

Improvedicing process capabilityVSAvoiddie strength

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The patent substitutes direct laser ablation of the die with laser-induced crack formation in the carrier substrate. The laser creates stress concentration points and crack paths in the carrier material, which then propagate during mechanical breaking without directly contacting or weakening the die structure, thereby maintaining die strength

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The carrier substrate serves as an intermediary that absorbs the laser energy and mechanical stress. The laser interacts with the carrier to create crack structures, and the carrier subsequently guides the breaking process, preventing direct interaction between the laser/dicing tools and the ultra-thin die, thus preserving die integrity and strength

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If plasma dicing with backside metallization is used, then dicing can be performed, but metal contamination and patterning difficulties occur

Engineering Contradiction:

Improvedicing process capabilityVSAvoidmetal contamination

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces plasma dicing with a laser-induced crack and mechanical breaking process. This substitution eliminates the plasma environment that causes metal contamination during metallization, while the laser and breaking process maintain effective die separation capability without introducing harmful contaminants

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent converts the potential harm of plasma processing into a benefit by using laser-induced crack formation instead. The laser process creates precise crack paths without the harmful side effects of plasma, and the subsequent mechanical breaking along these cracks achieves clean separation without metal contamination or patterning difficulties

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides a cost-effective dicing process for ultra-thin dies with smooth edges and prevents metal contamination on the sidewalls, facilitating compatible backside metallization and patterning, thereby enhancing the mechanical stability and processing efficiency of ultra-thin semiconductor devices.

Implementation Method 1

the arrangement of defects is configured to generate a crack structure extending from the arrangement of defects into the surface region

Methodology Applied

Scientific EffectCrack propagation: Fracture Mechanics

Data Source

PatentUS10748801B2Carrier arrangement and method for processing a carrier by generating a crack structure

Publication Date: 2020.08.18 INFINEON TECHNOLOGIES AG

AI summary

According to various embodiments, a method for processing a carrier may include: forming an arrangement of defects in the carrier, wherein a surface region of the carrier is disposed over the arrangement of defects at a first surface of the carrier, wherein the arrangement of defects is configured to generate a crack structure extending from the arrangement of defects into the surface region; partially removing the carrier to remove the arrangement of defects; and separating the surface region of the carrier into a plurality of surface region portions along the crack structure.