Semiconductor Component Transfer via Carrier Dicing and Batch Placement
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Solution Overview
Problem
Current mass transferring techniques for semiconductor devices are inefficient and have a low yield rate, necessitating improved methods for transferring semiconductor components onto target substrates while maintaining manufacturing efficiency.
Innovation Solution
A method involving providing a semiconductor substrate with initial units arranged at a first pitch, transferring it to a carrier, dicing into components with a second pitch, and then transferring these components onto a target substrate using a pick and place or laser transfer process, allowing for selective and batch processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transferring technique is used to transfer semiconductor devices, then manufacturing efficiency is improved, but transferring yield rate remains low
Solution Approach 1:
The semiconductor substrate is divided into multiple semiconductor components through dicing after transfer to carrier, allowing individual components to be transferred separately to target substrates, improving both efficiency and yield rate
Solution Approach 2:
A carrier is introduced as an intermediary substrate to receive the semiconductor substrate, perform dicing operations, and then transfer individual components to target substrates, enabling precise control and higher yield rates
2Manufacturing precision
If semiconductor substrate is diced into smaller components, then transferring precision is improved, but process complexity increases
Solution Approach 1:
The semiconductor substrate is transferred to a carrier before dicing, allowing all dicing operations to be performed in advance on the carrier, which simplifies the subsequent transfer process and maintains precision
Solution Approach 2:
The carrier serves as an intermediary platform that holds multiple diced components, enabling systematic processing and reducing overall process complexity despite the increased number of components
Data Source
AI summary
A method of manufacturing a semiconductor device including the following steps is provided herein. A semiconductor substrate is provided. The semiconductor substrate is transferred to a carrier. The semiconductor substrate on the carrier is diced into a plurality of semiconductor 5 components. A target substrate is provided. At least one of the semiconductor components is transferred onto the target substrate.