Carrier Disk Conductivity Recovery During Plasma-Enhanced ALD
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Solution Overview
Problem
The continuous deposition of thin films on carrier disks during atomic layer deposition leads to the formation of insulating films that reduce conductive properties and cause issues with process parameter observation and film uniformity, necessitating frequent cleaning and maintenance, which is costly and time-consuming.
Innovation Solution
A plasma-enhanced process is used to perform periodic maintenance by alternating between first and second atomic layer depositions on the carrier disk, forming conductive films to maintain conductive properties and extend maintenance cycles without opening the chamber, using different precursors for each deposition step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If continuous atomic layer deposition is performed on the carrier disk, then thin film production efficiency is improved, but insulating film accumulation reduces conductive properties and requires frequent cleaning
Solution Approach 1:
The patent implements periodic maintenance by alternating between substrate processing cycles and carrier disk maintenance cycles. During maintenance cycles, the carrier disk is removed and cleaned when insulating film thickness reaches a predetermined threshold, then returned to service. This periodic intervention prevents complete loss of conductive properties while maximizing production time between maintenance events.
Solution Approach 2:
The system incorporates monitoring of insulating film thickness on the carrier disk surface and uses this feedback to determine when maintenance is required. When the thickness reaches a predetermined value that would compromise conductive properties, the system triggers a maintenance cycle, creating a closed-loop control that optimizes the balance between production and reliability.
2Reliability
If frequent cleaning and maintenance of the carrier disk is performed, then conductive properties are maintained, but equipment usage time is reduced and costs increase
Solution Approach 1:
The system performs preliminary monitoring of insulating film accumulation during normal operation and schedules maintenance only when necessary, rather than performing routine cleaning at fixed intervals. This allows the carrier disk to remain in service as long as possible while maintaining acceptable conductive properties, maximizing equipment usage between maintenance events.
Solution Approach 2:
The patent changes the maintenance strategy from time-based or fixed-cycle cleaning to condition-based maintenance triggered by insulating film thickness measurements. By monitoring the actual condition parameter (film thickness) rather than using fixed schedules, the system optimizes the balance between maintaining conductive properties and maximizing equipment usage time.
3Reliability
If the insulating film thickness exceeds a predetermined value, then conductive properties deteriorate, but removing the carrier disk for cleaning increases maintenance time
Solution Approach 1:
The patent replaces complex real-time monitoring and adjustment mechanisms with a simpler threshold-based control system. A predetermined film thickness value is established as the trigger point for maintenance, eliminating the need for continuous complex measurements and decisions during operation. This simplifies the system while effectively managing the trade-off between conductive properties and maintenance time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively extends the maintenance cycle of the carrier disk, reduces cleaning costs and contamination risks, and maintains the conductive properties of the carrier disk, thereby improving equipment usage efficiency.
Implementation Method 1
performing a first atomic layer deposition on a substrate on a carrier disk to form a thin film on the substrate, wherein when the first atomic layer deposition is performed, an insulating film is formed on the carrier disk
Data Source
AI summary
This disclosure is a method of using plasma enhanced process to do periodic maintenance. The method includes performing a first atomic layer deposition on a substrate on a carrier disk to form a thin film on the substrate, and determining that an insulating film deposited on an edge of a surface of the carrier disk has a thickness greater than a pre-determined value. A second atomic layer deposition is performed on the carrier disk without the substrate placed thereon, to from a conductive film on the insulating film of the carrier disk, so that the carrier disk has conductive properties. Then the substrate is placed on the carrier disk, and the first atomic layer deposition is performed on the substrate on the carrier disk. Through the method, the cycle of cleaning and maintaining the carrier disk is greatly extended to improve the rate of equipment usage.