Component Carrier Ejector Mechanism for Low-Force Connector Disconnection
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Solution Overview
Problem
Current component carriers in computing systems, such as fan modules, are inconvenient and costly to replace due to limited space and increased force required for disconnecting connectors, often leading to the entire module being discarded instead of individual components.
Innovation Solution
A component carrier with an integrated ejector system that includes a baseboard, sidewalls, and an ejector with a handle and tab, allowing for easier removal of electronic components by leveraging mechanical advantage to reduce the force needed to disconnect connectors, and potentially integrating fan holders with fewer pieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of pins for connection between the fan connector and the motherboard is increased, then the connection reliability is improved, but the force required for disconnecting the connector increases
Solution Approach 1:
The ejector mechanism serves as an intermediary tool between the user and the connector. It provides mechanical advantage through a lever arm to amplify the user's input force, enabling disconnection of high-pin-count connectors without requiring excessive manual force. The ejector translates small user input force into large output force at the connector interface.
2Area of stationary object
If fan modules are positioned tightly adjacent to one another to maximize space utilization, then the area efficiency is improved, but the ease of operation for removing individual modules deteriorates
Solution Approach 1:
The ejector mechanism extracts the force application point from the limited space around the fan module to a more accessible location. By providing a lever arm that extends outward from the tightly packed module area, the ejector allows users to apply force at a convenient location while the actual disconnection action occurs at the connector interface deep within the confined space.
3Loss of time
If the entire fan module is discarded instead of replacing only the faulty component, then the time required for replacement is reduced, but the loss of substance increases
Solution Approach 1:
The connector design enables segmentation of the replacement process. The ejector mechanism allows for clean disconnection of the connector from the motherboard, facilitating replacement of only the faulty fan module while leaving the connector and other functional modules intact. This modular replacement approach reduces material waste compared to discarding entire assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables convenient and cost-effective removal of electronic components, reducing the force required by up to 80% and minimizing material costs by allowing individual module replacement rather than entire unit disposal.
Implementation Method 1
allowing for easier removal of electronic components by leveraging mechanical advantage to reduce the force needed to disconnect connectors
Data Source
AI summary
A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.