Fiber-Reinforced Carrier Element Gas Bubbles Moisture Resistance
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Solution Overview
Problem
Electronic components with rigid electrical connections face moisture ingress and corrosion issues when mounted in fiber-reinforced injection molded parts, as the casting compound fails to adhere sufficiently, leading to insulation problems.
Innovation Solution
A device featuring a fiber-reinforced, injection-molded carrier element with gas bubbles less than 10 mm from the filling compound, which improves adhesion by creating a self-organizing surface structure, allowing for better sealing and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a fiber-reinforced injection-molded carrier element is used to provide mechanical strength, then the structural strength is improved, but the adhesion of the filling compound to the carrier element deteriorates
Solution Approach 1:
The patent applies local quality by creating gas bubbles specifically in regions where the filling compound will be applied, rather than uniformly throughout the entire carrier element. This localized modification allows the filling compound to adhere properly to the carrier element surface while maintaining the overall structural strength provided by the fiber-reinforced material.
Solution Approach 2:
The patent introduces gas bubbles to create a porous structure on the surface of the carrier element. These pores increase the surface area and provide anchoring points for the filling compound, significantly improving adhesion. The porous surface allows the filling compound to mechanically interlock with the carrier element while the bulk material maintains its structural integrity.
2Object-affected harmful factors
If the filling compound is applied to provide moisture protection, then the moisture resistance is improved, but the electrical insulation reliability deteriorates due to poor adhesion and moisture ingress
Solution Approach 1:
The gas bubbles create a porous surface structure that enhances the mechanical bonding of the filling compound to the carrier element. This improved adhesion prevents moisture ingress at the interface between the filling compound and carrier element, thereby maintaining electrical insulation reliability while providing effective moisture protection.
Solution Approach 2:
The gas bubbles are intentionally created as temporary features during the molding process that serve their purpose of improving adhesion, then effectively 'disappear' or become integrated into the final structure. The bubbles themselves are not permanent structural elements but serve their function of enhancing filling compound adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the adhesion of the filling compound to the carrier element and electronic components, providing effective moisture resistance and long-term protection against corrosion.
Implementation Method 1
gas bubbles less than 10 mm away from the filling compound, which improves adhesion by creating a self-organizing surface structure
Data Source
Figure 1~2
Figure 3~5
AI summary
The present invention relates to a device (100) for the moisture-proof housing of conductors (104) of an electronic component (110). The device (100) comprises a fiber-reinforced, injection-moulded carrier element (101) which has a cavity for accommodating the electronic component (110) and is made from a thermoplastic material. The device (100) further comprises the electronic component (110) which is arranged in the cavity. A filling material (102) adheres to the carrier element (101) and the electronic component (110) and is arranged between the electronic component (110) and the carrier element (101). The device (100) further comprises an electric conductor (104) which is coupled to the electronic component (110) and the carrier element (101) and is surrounded by the filling material (102) at least in regions. The carrier element (101) contains gas bubbles (103) which are at a distance of less than 10 mm from the filling material (102).