Carrier Structure With Embedded Magnetic Elements
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Solution Overview
Problem
Conventional circuit carriers with annular circuits require additional magnetic elements on top and bottom, increasing overall thickness and hindering miniaturization efforts.
Innovation Solution
A carrier structure with a substrate and a patterned circuit layer featuring an annular circuit, where magnetic elements are embedded within openings in the substrate, allowing them to couple with the circuit and respond to electromagnetic fields while maintaining a thinner profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If magnetic elements are additionally disposed over and under the annular circuit in a built-up manner, then the magnetic force action of the electromagnetic field is increased, but the overall thickness of the circuit carrier is increased
Solution Approach 1:
The magnetic elements are embedded within openings formed in the substrate, nesting them inside the substrate thickness rather than stacking them externally. This allows the magnetic elements to be contained within the substrate's volume, achieving the inductance effect without increasing the overall carrier thickness.
Solution Approach 2:
The magnetic elements are positioned in the planar dimension within openings on the substrate surface, rather than extending in the thickness dimension. This dimensional repositioning allows the magnetic elements to couple with the annular circuit effectively while maintaining a thin profile.
2Length of stationary object
If magnetic elements are embedded within openings in the substrate, then the thickness is reduced, but the coupling effectiveness with the annular circuit must be maintained
Solution Approach 1:
The magnetic elements are strategically positioned within specific openings located adjacent to the annular circuit, creating localized regions of enhanced magnetic coupling. This local placement ensures effective interaction between the magnetic elements and the circuit while maintaining overall thinness.
Solution Approach 2:
The substrate itself acts as an intermediary structure that holds the magnetic elements in precise positions relative to the annular circuit. The substrate's openings provide a controlled environment for the magnetic elements to couple effectively with the circuit without requiring external mounting structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves an inductance effect with a thinner thickness by embedding magnetic elements within the substrate, contrasting with the built-up approach of conventional methods.
Implementation Method 1
an annular circuit configured to generate an electromagnetic field
Implementation Method 2
The magnetic element couples the annular circuit and acts in response to a magnetic force of the electromagnetic field
Data Source
AI summary
A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.