Carrier Structural Elements for Optoelectronic Flow Control

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Solution Overview

Problem

Existing arrangements of optoelectronic components on carriers face challenges in effectively hindering the flow of encapsulation materials, leading to overfilling and lateral flow issues, which can result in defects and inefficient material distribution.

Innovation Solution

Incorporating structural elements on the carrier with a rounding radius of less than 20 μm perpendicular to the flow direction, arranged transversely to impede the flow of materials, ensuring efficient prevention of material flow and distribution around the optoelectronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If structural elements with large rounding radius are used on the carrier, then the manufacturing process is easier, but the flow of encapsulation material cannot be effectively hindered, leading to overfilling and lateral flow defects

Engineering Contradiction:
Improveflow control effectivenessVSAvoidrounding radius control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by specifying a critical rounding radius threshold (less than 20 μm) for the structural elements. This precise parameter control transforms the structural elements from ineffective flow barriers to effective flow hinders, resolving the contradiction between manufacturing ease and flow control effectiveness. The encapsulation material cannot bridge across structural elements with sufficiently small rounding radii, preventing lateral flow and overfilling defects.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If no structural elements are provided on the carrier, then the device structure is simpler, but the encapsulation material flows laterally and causes overfilling defects

Engineering Contradiction:
Improvematerial distribution controlVSAvoidcarrier structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the carrier surface into regions separated by structural elements. These structural elements act as flow barriers that segment the encapsulation material flow path, preventing lateral flow and overfilling. The segmentation approach effectively controls material distribution without requiring complex overall device restructuring, thus resolving the contradiction between reliability and device complexity.

Inventive Principle:
Principle #1Segmentation

3Reliability

If structural elements with rounding radius less than 20 μm are used, then lateral flow of material is effectively prevented, but the manufacturing precision requirements increase

Engineering Contradiction:
Improveprevention of overfilling and lateral flowVSAvoidstructural element rounding radius precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent establishes a specific parameter threshold (rounding radius < 20 μm) that fundamentally changes the flow behavior of encapsulation material. This parameter change creates a clear design specification that, while precise, provides a measurable target for manufacturing. The threshold value balances the need for effective flow prevention with achievable manufacturing precision, resolving the contradiction by providing a concrete design criterion.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10629578B2Arrangement having a carrier and an optoelectronic component
Publication Date: 2020.04.21 AMS OSRAM INT GMBH
  • US10629578B2 patent drawing
  • US10629578B2 patent drawing
  • US10629578B2 patent drawing

AI summary

An arrangement includes a carrier; an optoelectronic component arranged on the carrier; and a material arranged on the carrier, wherein the carrier includes at least one structural element that hinders flow of the material in a flow direction, the structural element extends transversely to the flow direction, and the structural element has a rounding radius in a plane perpendicular to the transverse extent of the structural element less than 20 μm.