Component Carrier With Embedded Fluid Cooling Member
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers, such as printed circuit boards, lead to heat generation issues, limiting the performance and reliability of electronic devices, as existing cooling methods are inefficient and often require external heat sinks.
Innovation Solution
An electronic device design featuring a component carrier with a stack of conductive and insulating layers, integrated with a cooling member containing a fluid cooling unit, connected via a metallic structure for efficient heat transfer, eliminating the need for external heat sinks and enhancing mechanical and thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are miniaturized and densely mounted on component carriers, then device functionality and integration are improved, but heat generation increases and cooling becomes more difficult
Solution Approach 1:
The patent merges the component carrier and cooling member into a single integrated structure. The component carrier itself is designed with a fluid cooling unit embedded within it, eliminating the need for separate external cooling components. This integration allows heat from densely mounted electronic components to be directly transferred to the cooling fluid channels formed in the component carrier, effectively resolving the heat generation issue while maintaining high device functionality.
Solution Approach 2:
The patent introduces a cooling fluid as an intermediary medium to transfer heat away from the electronic components. The fluid cooling unit, with its channels formed in the component carrier, allows cooling fluid to flow through and absorb heat generated by the densely mounted components, thereby managing temperature while preserving device adaptability.
2Temperature
If external heat sinks are used for cooling, then heat removal is achieved, but device complexity and space requirements increase
Solution Approach 1:
The patent combines the component carrier and cooling member into one integrated unit. The component carrier is designed with embedded fluid cooling channels, eliminating the need for separate external heat sinks and cooling systems. This reduces device complexity while maintaining effective heat removal capabilities.
Solution Approach 2:
The patent transitions from external cooling (adding cooling components in the horizontal plane) to internal cooling (embedding cooling channels within the vertical structure of the component carrier). The fluid cooling unit utilizes the thickness dimension of the component carrier to create internal channels, thereby removing heat without increasing device footprint or complexity.
3Reliability
If component carriers are made mechanically robust for harsh conditions, then reliability is improved, but thermal management capabilities deteriorate
Solution Approach 1:
The patent employs composite material structures in the component carrier to achieve both mechanical robustness and thermal management. The component carrier is constructed with materials and layer structures that provide mechanical strength for harsh conditions while simultaneously incorporating fluid cooling channels for effective heat removal. This composite approach allows the component carrier to fulfill both mechanical and thermal functions.
Solution Approach 2:
The patent merges multiple functions into the component carrier: it serves as both the mechanical support structure and the cooling system. The component carrier is designed with integrated fluid cooling channels, allowing it to provide both mechanical robustness for harsh operating conditions and effective thermal management, thereby resolving the contradiction between reliability and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat removal from electronic components, improving device performance and reliability while maintaining a compact design, with reduced thermal resistance and increased cooling efficiency.
Implementation Method 1
the component carrier and the cooling member are connected by a (for example metallic) connection structure (which, for example, contributes to a heat removal from the electronic component to the cooling unit)
Implementation Method 2
a cooling member with a fluid cooling unit at least partially therein
Data Source
AI summary
An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.