Carrier-Free Thin Wafer Semiconductor Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor manufacturing is to produce thinner semiconductor wafers without the need for a carrier wafer, as the use of a carrier adds complexity and cost, and thinner wafers are susceptible to cracking and breakage during handling and manufacturing processes.
Innovation Solution
A method is developed to form a thin semiconductor substrate without a carrier by creating conductive vias, forming interconnect structures, depositing encapsulants, and removing portions of the substrate to expose these vias and bumps, thereby providing structural support and eliminating the need for a separate carrier wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the wafer thickness is reduced to minimize package height, then the package height is reduced, but the wafer becomes susceptible to cracking and breakage during handling and manufacturing processes
Solution Approach 1:
The method performs preliminary actions by forming the thin wafer to the target thickness before any thinning processes, and by pre-forming the encapsulant structure that will later provide support. The encapsulant is deposited and cured to create a protective framework before the wafer undergoes thinning, ensuring the wafer maintains integrity throughout the process.
Solution Approach 2:
The encapsulant acts as an intermediary element that provides structural support to the thin wafer. By depositing the encapsulant material over the wafer surface and forming it into a supportive structure, the wafer gains the strength needed to withstand handling and manufacturing processes without requiring a separate carrier wafer.
2Reliability
If a carrier wafer is used to support thin wafers during manufacturing, then the structural support is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The method merges the support function with the encapsulant structure itself. Instead of using a separate carrier wafer, the encapsulant is formed into a supportive framework that simultaneously provides structural support and serves as part of the final device structure. This eliminates the need for carrier wafer attachment and removal steps.
Solution Approach 2:
The encapsulant structure serves dual purposes: it provides structural support to the thin wafer during manufacturing and becomes an integral part of the final device structure. The encapsulant essentially serves itself by becoming both the support mechanism and a functional component of the finished device, eliminating the need for separate carrier components.
3Reliability
If a carrier wafer is used to prevent cracking and breakage, then the risk of damage is reduced, but the manufacturing cost increases
Solution Approach 1:
The method uses a disposable-like approach with the encapsulant material, which is deposited as a sacrificial or temporary support structure during manufacturing. The encapsulant provides the necessary support during critical manufacturing steps and is then removed or integrated, avoiding the need for expensive, reusable carrier wafers that require cleaning and preparation between uses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of thinner semiconductor substrates with reduced risk of damage, simplifying the manufacturing process and reducing costs by eliminating the need for a carrier wafer, while maintaining structural integrity and enabling efficient interconnectivity.
Implementation Method 1
a spinning mechanism to spin the semiconductor die and the encapsulant together
Implementation Method 2
The encapsulant is cured to form an encapsulant structure that protrudes from the thin substrate
Data Source
AI summary
A semiconductor device has a conductive via in a first surface of a substrate. A first interconnect structure is formed over the first surface of the substrate. A first bump is formed over the first interconnect structure. The first bump is formed over or offset from the conductive via. An encapsulant is deposited over the first bump and first interconnect structure. A portion of the encapsulant is removed to expose the first bump. A portion of a second surface of the substrate is removed to expose the conductive via. The encapsulant provides structural support and eliminates the need for a separate carrier wafer when thinning the substrate. A second interconnect structure is formed over the second surface of the substrate. A second bump is formed over the first bump. A plurality of semiconductor devices can be stacked and electrically connected through the conductive via.