Carrier Grinding for Clean Semiconductor Chip Surface Exposure
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Solution Overview
Problem
Conventional semiconductor device manufacturing methods face issues such as die shift, damage to temporary fixing material, peeling of glass carrier and encapsulant, and residue formation due to temporary fixing, leading to cleanliness and alignment challenges.
Innovation Solution
A method involving fixing semiconductor chips on a carrier using an adhesive layer, forming a re-distribution layer, and grinding the carrier to expose chip surfaces, utilizing a thermosetting adhesive with inorganic filler and controlled grindstone sizes for precise surface cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If temporary fixing material is used to fix semiconductor chips on carrier, then chip installation is simplified, but die shift occurs during encapsulant molding and alignment operation is required
Solution Approach 1:
The fixing process is divided into two stages: temporary fixing during chip installation using temporary fixing material, and permanent fixing during encapsulation using encapsulant material. This segmentation allows simplified installation while ensuring precision during molding by providing progressive fixation.
Solution Approach 2:
Temporary fixing material is applied beforehand to hold chips in position during installation and initial alignment. This preliminary action enables simplified chip placement while the subsequent encapsulation process provides the final precision fixing, eliminating the need for separate alignment operations.
2Ease of manufacture
If temporary fixing material is used, then chip installation is easier, but resin residue remains on chip surface and cleanliness is reduced
Solution Approach 1:
The harmful resin residue from temporary fixing material is completely removed from the chip surface through cleaning processes before encapsulation. This extraction of the contaminant allows the temporary fixing material to serve its installation function while eliminating its harmful residue effect.
Solution Approach 2:
The temporary fixing material's resin, which could be harmful as residue, is instead used beneficially as part of the encapsulant material composition. The cleaned temporary fixing material residue is incorporated into the encapsulation process, converting a potential contaminant into a functional component.
3Reliability
If temporary fixing material is sandwiched between carrier and encapsulant, then chip is fixed, but outer peripheral portion is exposed and may be damaged by chemical solution
Solution Approach 1:
The temporary fixing material and encapsulant material are merged into a single integrated encapsulation structure. The temporary fixing material is completely enclosed within the encapsulant, eliminating exposed portions that would be vulnerable to chemical solution damage while maintaining fixation reliability.
Solution Approach 2:
The temporary fixing material is nested within the encapsulant material, creating a protective hierarchy where the encapsulant serves as an outer shell that shields the inner temporary fixing material from harmful chemical solutions while maintaining the fixation function.
4Ease of operation
If temporary fixing material is peeled off from encapsulant, then chip can be released, but crack is generated between chip and encapsulant
Solution Approach 1:
Instead of peeling the temporary fixing material off the encapsulant, the process is inverted: the encapsulant is removed or cut away from the chip, leaving the temporary fixing material adhered to the chip surface. This inversion prevents crack generation by avoiding the peeling action that would stress the chip-encapsulant interface.
Solution Approach 2:
The encapsulant material is extracted or removed from around the chip after encapsulation, rather than removing the temporary fixing material. This extraction approach releases the chip without subjecting it to the damaging peeling forces that would create cracks at the chip-encapsulant boundary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents chip displacement, ensures clean chip surfaces without residue, and allows for efficient reuse of materials, enhancing manufacturing efficiency and environmental sustainability.
Implementation Method 1
each of a plurality of semiconductor chips is fixed on a carrier by an adhesive layer
Implementation Method 2
the carrier and the adhesive layer are scraped off to expose second chip surfaces
Data Source
AI summary
A method for manufacturing a semiconductor device includes preparing a laminate in which each of a plurality of semiconductor chips is fixed on a carrier by an adhesive layer, wherein the plurality of semiconductor chips are fixed on a first carrier surface of the carrier such that each connection terminal of the plurality of semiconductor chips faces away from the carrier, forming a re-distribution layer that connects to each connection terminal of the plurality of semiconductor chips, and grinding the carrier in the laminate from a second carrier surface opposite to the first carrier surface toward the first carrier surface. In the grinding, the carrier and the adhesive layer are scraped off to expose second chip surfaces of the plurality of semiconductor chips, wherein the second chip surfaces are located on opposite side of the first chip surfaces on which the re-distribution layer is provided.