Carrier Jig Suction Layout for Low-Deformation Substrate Heating
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Solution Overview
Problem
Semiconductor manufacturing apparatuses, such as die bonders, face challenges in reducing substrate deformation during conveyance and heating, which can lead to conveyance failures and recognition errors.
Innovation Solution
A semiconductor manufacturing apparatus is designed with a carrier jig that includes adsorption holes and a frame section to hold the substrate, and a stage with a suction port and heating device, allowing for precise adsorption and heating to minimize substrate deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is conveyed to the stage and heated, then the bonding process can be performed, but the substrate may be deformed causing conveyance failures
Solution Approach 1:
The substrate support surface is divided into multiple independent adsorption holes instead of a continuous support surface. This segmentation allows localized adsorption forces to be applied at discrete points, reducing overall substrate deformation while maintaining effective conveyance and heating capabilities
Solution Approach 2:
The adsorption holes are strategically positioned to provide localized adsorption forces at critical areas of the substrate. This local quality approach ensures that the substrate is held firmly during conveyance and heating without applying excessive force across the entire substrate surface that would cause deformation
2Temperature
If the bond stage heats the substrate, then the bonding material can be activated, but the substrate may be deformed
Solution Approach 1:
The heating function is combined with the segmented adsorption hole structure, where heat is applied through the same localized areas that provide adsorption. This segmentation allows thermal energy to be delivered effectively while the discrete adsorption points prevent uniform thermal expansion and deformation across the entire substrate
Solution Approach 2:
The adsorption holes act as an intermediary structure that mediates between the heating function and the substrate. The holes provide thermal conduction paths while simultaneously creating mechanical support points that counteract thermal deformation, allowing heating to occur without excessive substrate distortion
3Reliability
If the substrate is held firmly during conveyance, then conveyance failures are reduced, but the substrate may be deformed due to excessive force
Solution Approach 1:
The support surface is segmented into multiple adsorption holes that distribute the holding force across multiple discrete points rather than applying force uniformly across the entire substrate. This segmentation provides firm conveyance reliability while preventing excessive localized stress that would cause deformation
Solution Approach 2:
The adsorption parameters (such as suction pressure) can be adjusted independently for different regions or conditions. This parameter control allows the system to provide just enough holding force for reliable conveyance without exceeding the threshold that would cause substrate deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces substrate deformation and conveyance failures, enabling accurate substrate recognition and improved bonding processes.
Implementation Method 1
a carrier jig including a mounting section having an adsorption hole for adsorbing a substrate to be mounted
Implementation Method 2
a stage including a mounting section having a suction port communicating with the adsorption hole of the carrier jig to adsorb the substrate and a heating device for heating the substrate
Data Source
AI summary
A semiconductor manufacturing apparatus includes: a carrier jig including a mounting section having an adsorption hole for adsorbing a substrate to be mounted and a frame section for holding a peripheral edge of the substrate; and a stage including a mounting section having a suction port communicating with the adsorption hole of the carrier jig to adsorb the substrate and a heating device for heating the substrate.