Package Carrier Release Structure for Laser Debonding Reuse
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods of fabricating semiconductor package structures are inadequate in terms of efficiency and environmental sustainability, particularly in the recycling and reuse of carriers during the manufacturing process.
Innovation Solution
A method involving the use of laser-assisted debonding of carriers, followed by wet etching and grinding processes, to recycle and reuse carriers, thereby reducing manufacturing costs and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional carrier removal methods are used, then carriers can be removed from packages, but the process is time-consuming and not environmentally sustainable
Solution Approach 1:
A release layer is formed over the carrier surface before bonding the die to the carrier. This preliminary action enables subsequent laser-assisted debonding, allowing the release layer to absorb laser energy and facilitate carrier removal without damaging the die or carrier, thus improving recycling efficiency while reducing time
Solution Approach 2:
The patent replaces traditional mechanical or chemical carrier removal methods with laser-assisted debonding. The laser process provides precise, controlled energy delivery that separates the die from the carrier through the release layer, eliminating the need for time-consuming mechanical grinding or chemical etching processes
2Ease of manufacture
If carriers are reused through traditional methods, then cost reduction is achieved, but environmental sustainability is compromised
Solution Approach 1:
The patent replaces traditional mechanical grinding and chemical etching processes with laser-assisted debonding. This substitution eliminates harmful chemicals and reduces material waste, making the carrier recycling process environmentally sustainable while maintaining cost-effectiveness through carrier reuse
Solution Approach 2:
The patent implements a carrier recovery process where carriers are carefully separated from used dies and prepared for reuse. The release layer enables clean separation that preserves carrier integrity, allowing carriers to be recovered and reused multiple times, reducing waste and environmental impact while maintaining manufacturing cost efficiency
3Productivity
If laser process is used to debond carrier, then carrier recycling efficiency is improved, but energy consumption increases
Solution Approach 1:
The release layer acts as an intermediary that absorbs laser energy and converts it to thermal energy for debonding. This intermediary layer enables efficient energy transfer and localized heating at the die-carrier interface, improving recycling efficiency while minimizing overall laser energy consumption by concentrating energy where needed
Solution Approach 2:
The laser process induces phase transitions in the release layer material, transforming it from a bonded state to a decomposed or vaporized state that facilitates carrier separation. This phase transition mechanism enables efficient debonding with controlled energy input, improving recycling efficiency while managing energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency and sustainability of the carrier recycling process, leading to cost reduction and environmental friendliness in semiconductor package structure fabrication.
Implementation Method 1
performing a laser process to divide the release structure into a first portion and a second portion, thereby debonding the first carrier from the first die
Data Source
AI summary
Provided is a method of fabricating a package structure including: forming a first bonding layer over a first surface of a first die; forming a release structure over a first carrier; bonding the first die to the first carrier by contacting the first bonding layer with the release structure; performing a laser process to divide the release structure into a first portion and a second portion, thereby debonding the first carrier from the first die; and performing a first removal process on the first portion of the release structure over the first carrier to expose a surface of the first carrier. The cleaned first carrier can be reused to fabricate another package structure, thereby reducing manufacturing costs and be greener or more environmentally friendly.