Bidirectional Switch Carrier Layout for High-Density Packaging
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Solution Overview
Problem
Current bidirectional switches realized in a single semiconductor device have limitations in power density and require larger package sizes and higher production costs.
Innovation Solution
A semiconductor device design featuring two semiconductor chips with transistor structures coupled via their drain electrodes, arranged on a carrier with encapsulation and terminal configurations that allow for high power density and reduced package size, including monolithic integration and separate carriers with bonding wires for improved electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If bidirectional switches are realized in a single semiconductor device, then device integration is improved, but power density is insufficient
Solution Approach 1:
The bidirectional switch is divided into two separate semiconductor chips, each containing a transistor structure. The first chip includes a first transistor with source, drain, and gate electrodes, while the second chip includes a second transistor with corresponding electrodes. This segmentation allows each chip to be optimized independently for power density while maintaining integration through the carrier substrate.
Solution Approach 2:
The patent utilizes the third dimension by arranging the two semiconductor chips on opposite sides of a carrier substrate. The first semiconductor chip is arranged on a first main face of the carrier, and the second semiconductor chip is arranged on a second main face of the carrier opposite to the first main face. This vertical stacking approach increases power density without increasing the horizontal package footprint.
2Area of stationary object
If package size is reduced, then device miniaturization is improved, but manufacturing complexity increases
Solution Approach 1:
The device is segmented into two separate semiconductor chips mounted on a carrier, allowing independent fabrication and testing of each chip before final assembly. This segmentation simplifies manufacturing by enabling modular production processes and reducing the complexity of fabricating a single integrated device with all functions.
Solution Approach 2:
The carrier substrate serves multiple functions: it provides mechanical support for both semiconductor chips, establishes electrical connections between the chips and external terminals, and enables compact packaging. This multi-functionality reduces the number of separate components needed, thereby simplifying manufacturing while achieving miniaturization.
3Ease of manufacture
If production cost is reduced, then economic viability is improved, but material quality may compromise
Solution Approach 1:
By dividing the bidirectional switch into two separate semiconductor chips, the patent enables standard fabrication processes to be used for each chip independently. This segmentation allows for optimized material selection and manufacturing processes for each chip, reducing overall production costs while maintaining high material quality and device reliability through specialized optimization of each component.
Data Source
AI summary
A semiconductor includes a carrier; a semiconductor element arranged on the carrier; a first row of terminals arranged along a first side face of the carrier; a second row of terminals arranged along a second side face of the carrier opposite the first side face; and an encapsulation body encapsulating the semiconductor element, wherein the semiconductor element comprises a first transistor structure and a second transistor structure, wherein the first row of terminals comprises a first gate terminal, a first sensing terminal coupled, and a first power terminal, wherein the second row of terminals, a second sensing terminal, and a second power terminal.