Carrier Leadframe Segmentation for Pre-Singulation LED Testing
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Solution Overview
Problem
The dicing-type carrier leadframe process for light emitting diodes (LEDs) generates significant plastic and metal dust, degrades product reliability, and lacks the ability to perform light-on tests before encapsulation, requiring additional instruments and time for surface orientation and measurement.
Innovation Solution
A carrier leadframe with mechanically engaged carriers that allow for quick material release after die bonding and wire bonding, enabling electric measurements before material release, and featuring electrically isolated carriers to facilitate efficient production of light emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing-type carrier leadframe process is used to mold plastic body on metal sheet material and perform die bonding, wire bonding and encapsulation, then light emitting devices can be produced, but a large amount of plastic and metal dusts are produced during dicing that pollute product surfaces and degrade reliability
Solution Approach 1:
The patent divides the integrated leadframe into multiple separate carriers, each capable of independently holding an LED chip. This segmentation allows each carrier to be processed and cleaned individually, preventing cross-contamination from dicing dust and enabling better surface cleanliness while maintaining production efficiency
Solution Approach 2:
The patent extracts the carriers from the traditional integrated leadframe structure, separating them into individual units that can be independently handled. This extraction eliminates the need for dicing the entire leadframe, thereby preventing dust generation while maintaining the ability to produce multiple LED devices
2Productivity
If the dicing-type process is used where metal sheet material and plastic body are diced away simultaneously, then individual light emitting devices are formed, but the process does not allow for light-on test prior to encapsulation and requires additional instruments and time for surface orientation and measurement
Solution Approach 1:
The patent enables preliminary light-on testing to be performed on LED chips while they are still mounted on the carriers, before the final encapsulation and dicing steps. This preliminary action allows for early detection of defective chips, preventing wasted time on subsequent processing of non-functional devices and eliminating the need for post-singulation orientation and measurement adjustments
Data Source
AI summary
A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.