Carrier-less Optoelectronic Semiconductor Component Production
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Solution Overview
Problem
Conventional optoelectronic semiconductor components often suffer from increased thermal and electrical resistance, as well as deteriorated optical properties due to the presence of a growth substrate or carrier, which complicates their production and performance.
Innovation Solution
A method for producing 'carrier-less' semiconductor chips by arranging semiconductor chips on an auxiliary carrier, which provides mechanical stability, and then separating and detaching the auxiliary carrier, allowing for the removal of any growth substrate or carrier, thereby improving the optical and electrical properties of the semiconductor component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a growth substrate or carrier is used to provide mechanical stability during production, then the mechanical stability is improved, but the thermal and electrical resistance increases and optical properties deteriorate
Solution Approach 1:
The patent applies preliminary action by providing mechanical stability through a carrier during the production process, then removing it after the semiconductor chip is formed. The carrier is used temporarily to ensure mechanical stability during epitaxial growth and processing, but is subsequently removed to eliminate its negative effects on thermal, electrical, and optical properties in the final product.
Solution Approach 2:
The patent applies the extraction principle by completely removing the growth substrate or carrier from the final semiconductor chip structure. The carrier is extracted after serving its purpose during production, resulting in a 'carrier-less' chip that achieves superior thermal, electrical, and optical performance without the carrier's detrimental effects.
2Stability of the object's composition
If a growth substrate or carrier is present, then mechanical stability is improved, but thermal resistance increases
Solution Approach 1:
The carrier is used temporarily during production to provide mechanical stability, then removed to eliminate thermal resistance. This preliminary use followed by removal allows the chip to achieve low thermal resistance in the final product while maintaining mechanical stability during the critical production phases.
Solution Approach 2:
The carrier is completely extracted from the final chip structure to eliminate thermal resistance. The removal of the carrier substrate results in a carrier-less chip with superior thermal management properties, essential for high-power optoelectronic applications.
3Stability of the object's composition
If a growth substrate or carrier is present, then mechanical stability is improved, but electrical resistance increases
Solution Approach 1:
The carrier provides mechanical stability during production, then is removed to eliminate electrical resistance. This approach allows the chip to achieve superior electrical contact properties in the final product while maintaining structural integrity during manufacturing processes.
Solution Approach 2:
The carrier is completely removed from the final chip structure to eliminate electrical resistance and improve electrical properties. The resulting carrier-less chip achieves optimal electrical contact with mounting substrates, enhancing overall device performance.
4Reliability
If the carrier is completely removed to improve optical properties, then the optical properties are improved, but the production complexity increases
Solution Approach 1:
The carrier is used during production to simplify handling and processing, then removed in a controlled final step to achieve superior optical properties. This preliminary use of the carrier actually simplifies the overall production process by providing mechanical support during critical growth and processing stages.
Solution Approach 2:
The carrier is completely extracted to achieve optimal optical properties. The removal process is integrated into the production flow, and while it adds a step, it enables superior optical performance that justifies the additional processing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of semiconductor components with enhanced efficiency and reduced thermal and electrical resistance, leading to improved performance and simplified processing, suitable for high-power applications like automobile headlights.
Implementation Method 1
The carrier has sufficient thickness to be mechanically self-supporting
Implementation Method 2
the carrier is first thinned by means of a polishing process
Implementation Method 3
then completely removed by means of an etching process
Implementation Method 4
The auxiliary carrier is separated in particular at imaginary seams between two adjacent semiconductor chips
Implementation Method 5
The auxiliary carrier parts are detached from the semiconductor component by mechanical, chemical, or optical methods
Implementation Method 6
The auxiliary carrier parts are detached from the semiconductor component by mechanical, chemical, or optical methods
Implementation Method 7
The auxiliary carrier parts are detached from the semiconductor component by mechanical, chemical, or optical methods
Data Source
AI summary
In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.