Carrier-less Silicon Interposer with Photo-patterned Polymer Substrate
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Solution Overview
Problem
Current interposer structures and fabrication processes are inadequate for achieving compact, high-density interconnects between microelectronic elements with low impedance, which is essential for advanced portable devices and data servers, as they fail to effectively manage thermal expansion and mechanical stress.
Innovation Solution
A component with a first element of low thermal expansion material and a second element featuring electrically insulated structures separated by gaps, filled with insulating materials, and conductive interconnects that reduce stress and facilitate efficient electrical connections between terminals and conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interposer structures are used, then electrical connections between microelectronic elements can be established, but mechanical stress and thermal expansion issues arise that limit compactness and reliability
Solution Approach 1:
The interposer structure is segmented into multiple functional layers including a substrate layer, an insulating layer with through-holes, and a conductive layer. This segmentation allows each layer to independently manage specific functions (mechanical support, electrical insulation, electrical connection) thereby reducing overall mechanical stress while maintaining structural simplicity
Solution Approach 2:
The interposer employs composite material construction with a substrate having specific thermal expansion properties, combined with insulating materials filled in through-holes and conductive materials for interconnects. This composite approach enables tailored thermal and mechanical properties that reduce stress while keeping the overall structure compact and manageable
2Speed
If interconnect length is reduced to minimize signal propagation delays, then bandwidth improves, but manufacturing precision requirements increase
Solution Approach 1:
The insulating layer with pre-formed through-holes is created before depositing the conductive interconnect layer. This preliminary action establishes precise alignment guides for the conductive traces, enabling short interconnect lengths with minimal signal delay while maintaining manufacturability through standardized hole-patterning processes
Solution Approach 2:
The interposer structure provides localized precision features through the through-hole patterns in the insulating layer, which serve as alignment references for conductive interconnect formation. This local quality enhancement allows precise interconnect placement without requiring extreme global manufacturing precision, enabling short trace lengths for high-speed signaling
3Ease of manufacture
If photo patterned polymer is used as substrate, then manufacturing ease and cost are improved, but thermal expansion management becomes more challenging
Solution Approach 1:
The substrate is selected with specific thermal expansion parameters that match or complement the attached semiconductor devices. By carefully choosing polymer composition and cross-linking density, the thermal expansion coefficient is optimized to reduce thermal stress during processing and operation, while maintaining the manufacturing advantages of photo-patternable polymer substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces mechanical stress and signal propagation delays, enabling more compact and efficient interconnects with improved thermal performance, enhancing the bandwidth and reducing power consumption in complex electronic devices.
Implementation Method 1
a photo patterned polymer as substrate
Data Source
AI summary
A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/.degree. C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.