Carrier Material Via Segmentation for Thermal Management
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Solution Overview
Problem
Existing methods for heat dissipation in thermal and electric components, such as high-frequency amplifiers, face challenges in achieving efficient and cost-effective heat dissipation while maintaining high carrier material yield and high-frequency properties, with current approaches either being costly or providing poor heat dissipation.
Innovation Solution
A method involving repeated hole formation in the carrier material, where each hole is partially filled with a conductive material, and additional holes are generated to overlap or adjoin the first holes, allowing for improved heat dissipation without the need for expensive materials like copper inlays, thereby enhancing thermal and electric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If deep milling or copper inlays are used to improve heat dissipation, then heat dissipation properties are improved, but manufacturing cost increases and carrier material yield decreases
Solution Approach 1:
The via structure is segmented into multiple layers with different filling materials. The first via layer uses a cost-efficient filling material while the second via layer uses a high-thermal-conductivity material, allowing optimized heat dissipation at critical interfaces without uniformly expensive materials throughout the entire via structure.
Solution Approach 2:
High-thermal-conductivity material is applied locally only where most needed for heat dissipation (at the via interfaces and in the second via layer), rather than uniformly throughout. This localized application of premium material optimizes thermal performance while controlling costs.
2Ease of manufacture
If vias with cost-efficient filling material are used, then manufacturing cost is reduced, but heat dissipation properties are insufficient
Solution Approach 1:
The via structure employs composite materials with different thermal conductivity properties in different layers. The first via layer uses cost-efficient material while the second via layer uses high-thermal-conductivity material, creating a composite via structure that balances cost and thermal performance.
Solution Approach 2:
The solution adds a vertical dimension to heat dissipation by creating multiple via layers at different depths. The second via layer extends the heat dissipation path vertically into the carrier material, providing enhanced thermal management without increasing lateral material costs.
3Temperature
If thicker copper layers are used to improve heat dissipation, then heat dissipation is improved, but design rules are limited
Solution Approach 1:
Instead of using thick copper layers directly, the invention creates via structures that replicate the heat dissipation function through vertical conductive paths. The via layers serve as copied thermal conduction pathways that achieve heat dissipation without the manufacturing constraints of thick copper planar layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves improved heat dissipation and high-frequency properties in a cost-effective manner without compromising carrier material yield, offering a more stable and efficient solution compared to traditional methods.
Implementation Method 1
Each of the multiple vias comprises at least a first material... the thermal conductivity of the material used for establishing the vias
Data Source
Figure 1
Figure 2~2B
Figure 3
AI summary
The present disclosure relates to a method for manufacturing a carrier material for use in an electric and/or thermal component and to a carrier material. The method comprises at least steps of generating at least one first hole in at least a first surface of the carrier material, applying a first material at least partially on the first surface in an area of the at least one first hole such that the first surface is partially covered by means of the first material, applying a second material to fill at least a portion of the at least one first hole, and generating at least one additional second hole in at least the first surface of the carrier material adjacent the first hole such that the at least one second hole at least partially overlaps or directly adjoins the at least one first hole and/or the second material.