Processing Carrier Module Resin Collection for 3D Printing

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Solution Overview

Problem

In existing 3D printing techniques, residual resins from the photocuring process are often contaminated and cannot be reused, leading to waste and increased manufacturing costs.

Innovation Solution

A processing carrier module with a carrier layer and container design that allows for the recycling of residual resin during the spin dry process, where the container engages with the carrier layer to receive and prevent contamination of the resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If resin is removed by spinning in existing spin dry devices, then residual resin is separated from the three-dimensional object, but the resin becomes contaminated and cannot be reused

Engineering Contradiction:
Improveresin wasteVSAvoidresin contamination
Core Design Contradiction:
Loss of substanceVSObject-affected harmful factors

Solution Approach 1:

A collection container is introduced as an intermediary component between the carrier layer and the spin dry device environment. The container receives residual resin during the spinning process, preventing direct contact with contaminated surfaces. The container includes a collection space positioned to capture resin flowing from the carrier layer, and features engagement structures that secure it to the carrier layer, ensuring the resin is collected without contamination.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention enables recovery of residual resin that would otherwise be discarded as waste. By providing a dedicated collection container that captures resin during spinning, the system allows the collected resin to be reused in subsequent 3D printing processes, transforming what was previously waste material into a recoverable resource.

Inventive Principle:
Principle #34Discarding and recovering

2Ease of repair

If a collection container is added to the spin dry device, then resin recycling capability is improved, but the device complexity increases

Engineering Contradiction:
Improveresin recycling functionVSAvoidspin dry device structure
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The spin dry device is segmented into functional modules: the existing spinning mechanism and the added collection container as a separate, attachable component. The container includes engagement structures (such as protrusions fitting into recesses or snap-fit mechanisms) that allow it to be securely attached to the carrier layer without permanently modifying the spin dry device itself, maintaining modularity and ease of maintenance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The collection container serves multiple functions: it collects residual resin during spinning, prevents contamination, and enables resin reuse. By designing a multi-functional component that combines collection, containment, and engagement features, the invention adds recycling capability without requiring multiple separate devices or complex systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively recycles residual resin, reducing waste and manufacturing costs by preventing contamination and enabling the reuse of resin in 3D printing processes.

Implementation Method 1

the method of manufacturing three-dimensional objects using the photocuring properties and thermoplastic properties of various resins is one of the main development projects. However, after the three-dimensional object is cured, the resin remaining on the three-dimensional object must be removed by spinning

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS11654631B2Processing carrier module and spin dry device
Publication Date: 2023.05.23 AMPLIFI TECH (XIAMEN) LTD
  • US11654631B2 patent drawing
  • US11654631B2 patent drawing
  • US11654631B2 patent drawing

AI summary

The present disclosure is related to a processing carrier module comprising a carrier layer and a container. The carrier layer comprises a carrier surface, a first lateral surface, and a second lateral surface. The first lateral surface is connected to carrier surface and has at least one first protruding structure. The second lateral surface is connected to carrier surface and has at least one second protruding structure. The first lateral surface is opposite to the second lateral surface. The container comprises at least one first fastening structure and at least one second fastening structure. The first fastening structure and the second fastening structure are respectively disposed on opposite sides of the container. The first fastening structure engages with the first protruding structure, and the second fastening structure engages with the second protruding structure.