Intermediate Carrier Package Layout for EMI Shielding and Top-Side Cooling
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Solution Overview
Problem
Conventional semiconductor packages face issues with electric reliability and electromagnetic interference (EMI) protection, particularly lacking effective EMI shielding at the top side, which can degrade performance and functionality.
Innovation Solution
A package design featuring a partially electrically conductive carrier with a coupling structure and a separate reference potential structure, an intermediate insulating structure, and an encapsulant that exposes these structures for external connection, providing EMI protection and top-side cooling while ensuring high reliability and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional package uses a simple carrier structure without separate reference potential structure, then the device complexity is reduced, but the electric reliability and EMI protection are degraded
Solution Approach 1:
The carrier is segmented into functionally distinct parts: a coupling structure for electrical connections and a separate reference potential structure for EMI shielding and grounding. This segmentation allows each part to optimize its specific function, improving overall electric reliability while maintaining manageable complexity through clear functional separation.
Solution Approach 2:
An intermediate structure is introduced as a mediator between the carrier and the electronic component. This intermediate structure provides additional functional layers including mounting surfaces and potential EMI shielding, enhancing electric reliability without requiring direct modification of the core carrier structure.
2Strength
If the carrier is fully encapsulated for protection, then the mechanical stability is improved, but the heat dissipation and EMI shielding capabilities are reduced
Solution Approach 1:
The reference potential structure is extracted from full encapsulation and exposed at the top surface of the package. This extraction allows the reference potential structure to perform its EMI shielding function effectively while the rest of the package remains encapsulated for mechanical protection. The exposed structure can also facilitate heat dissipation pathways.
Solution Approach 2:
Different parts of the package have different encapsulation levels: the coupling structure and reference potential structure are partially exposed at the top surface, while the intermediate structure and electronic component are fully encapsulated. This local differentiation allows each region to have the properties needed for its specific function - exposure for EMI shielding and heat dissipation, encapsulation for mechanical protection.
3Reliability
If additional structures are added for EMI protection and heat dissipation, then the electric reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The reference potential structure is integrated into the carrier as a unified component rather than being a separate attachment. This merging reduces the number of discrete parts and assembly steps, simplifying manufacturing while still providing the necessary EMI protection and heat dissipation functions.
Solution Approach 2:
The reference potential structure serves multiple functions simultaneously: it provides EMI shielding, establishes a reference potential for electrical stability, and facilitates heat dissipation. This multi-functionality reduces the need for separate dedicated components, thereby simplifying the overall manufacturing process while enhancing electric reliability.
Data Source
AI summary
A package is disclosed. In one example, the package includes an at least partially electrically conductive carrier having a coupling structure and a reference potential structure which is electrically decoupled from the coupling structure and which is configured to be brought to an electric reference potential during operation of the package, an intermediate structure at the carrier and having an electrically insulating structure oriented towards the carrier and having a mounting structure facing away from the carrier. An electronic component is mounted on the mounting structure and being electrically coupled with the coupling structure. An encapsulant is encapsulating at least part of the intermediate structure, at least part of the electronic component, and part of the carrier so as to expose at least part of the reference potential structure and at least part of the coupling structure.