Carrier Plate Sensor Singulation for Parallel Optical Assembly

Solution Overview

Problem

Current methods for producing optical sensors are inefficient due to the individual adhesive bonding of radiation-transmissive optical elements, which increases production time and costs, especially in large volumes.

Innovation Solution

A method involving a carrier plate with semiconductor chips, where multiple radiation-transmissive optical elements are provided jointly, allowing for parallel processing and singulation into separate sensors, reducing time and costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If frame parts are individually adhesively bonded one after another on the carrier plate, then each sensor can be assembled with proper positioning, but production time and costs increase significantly

Engineering Contradiction:

Improveease of manufactureVSAvoidproductivity

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent applies preliminary action by pre-assembling multiple frame parts with their respective optical elements and semiconductor chips onto a single carrier plate in a parallel fashion before final singulation. This allows batch processing of multiple sensors simultaneously, transforming the sequential individual bonding process into a parallel batch assembly process, thereby significantly improving productivity while maintaining manufacturing quality

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent merges multiple individual sensor assembly operations into a single integrated batch assembly process. By combining multiple frame parts, optical elements, and semiconductor chips onto one carrier plate simultaneously, the process consolidates numerous sequential steps into fewer parallel operations, resolving the contradiction between ease of manufacture and productivity

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If frame parts are individually adhesively bonded one after another on the carrier plate, then each sensor can be assembled with proper positioning, but production costs increase

Engineering Contradiction:

Improveease of manufactureVSAvoidproduction cost

Core Design Contradiction:

Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent applies preliminary action by pre-assembling multiple frame parts with their respective optical elements and semiconductor chips onto a single carrier plate in a parallel fashion before final singulation. This allows batch processing of multiple sensors simultaneously, transforming the sequential individual bonding process into a parallel batch assembly process, thereby significantly improving productivity while maintaining manufacturing quality

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent merges multiple individual sensor assembly operations into a single integrated batch assembly process. By combining multiple frame parts, optical elements, and semiconductor chips onto one carrier plate simultaneously, the process consolidates numerous sequential steps into fewer parallel operations, resolving the contradiction between ease of manufacture and productivity

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If multiple radiation-transmissive optical elements are provided jointly on the carrier plate, then production time is reduced through parallel processing, but the complexity of the assembly process increases

Engineering Contradiction:

Improveproduction timeVSAvoidassembly complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the batch assembly process into distinct modular stages: carrier plate preparation, semiconductor chip mounting, frame part attachment, optical element integration, and final singulation. This modular segmentation manages assembly complexity by breaking down the parallel processing workflow into manageable, standardized steps that can be executed systematically while maintaining high productivity

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS10749055B2Production of sensors

Publication Date: 2020.08.18 OSRAM OLED

AI summary

A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.