Carrier Plate Removal via Stepped Edge Processing
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Solution Overview
Problem
In the fan-out panel level packaging (FOPLP) process, it is difficult to remove a carrier plate from a packaged panel without damaging either the carrier plate or the packaged panel due to the strong adhesive strength of the provisional bonding layer.
Innovation Solution
A carrier plate removing method that involves forming a stepped portion on the carrier plate by processing its peripheral edge from the underside, allowing for easy removal by applying force to the stepped portion, which can include using a cutting blade or laser processing, and optionally using a fluid or vibration to aid in the separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the carrier plate is peeled off before the packaged panel is divided, then the removal process can be performed earlier in the manufacturing sequence, but the strong adhesive strength of the provisional bonding layer causes damage to the packaged panel and carrier plate
Solution Approach 1:
The invention divides the carrier plate into two distinct levels: a first level that remains bonded to the packaged panel, and a second level that is removed. This segmentation allows the bonded portion to provide structural support during removal, preventing damage to the packaged panel while enabling complete separation of the removable portion.
Solution Approach 2:
The invention introduces a vertical dimension to the removal process by creating a stepped structure with different height levels. The first level maintains the bonded connection while the second level extends upward to provide a removable portion, transforming a two-dimensional bonding problem into a three-dimensional structural solution.
2Productivity
If force is applied directly to the packaged panel to separate it from the carrier plate, then the separation can be achieved, but the strong adhesive strength causes damage to both the packaged panel and carrier plate
Solution Approach 1:
The invention extracts the problematic adhesive interface from the removal process by creating a stepped structure. The adhesive bond is retained only at the first level where it provides structural support, while the second level is completely freed from adhesive constraints, allowing damage-free removal.
Solution Approach 2:
The first level of the carrier plate serves as an intermediary element that maintains the adhesive bond to the packaged panel while supporting the removal of the second level. This intermediary structure transfers the removal forces away from the packaged panel, preventing damage.
Data Source
AI summary
There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.