Carrier Tape Pockets With Inclined Sidewalls for Chip Stack Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing carrier structures for semiconductor chip stack structures lack effective protection and stability during transportation and storage, particularly due to inadequate accommodation and potential contamination risks.
Innovation Solution
A carrier structure comprising a carrier tape with pockets that include inclined sidewalls and supports, designed to accommodate semiconductor chip stack structures with a base chip, through-vias, connection members, and a molding member, ensuring secure positioning and reduced contact area with the carrier tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chip stack structures are placed in conventional carrier pockets, then they can be transported and stored, but the structures are vulnerable to damage and contamination due to inadequate protection
Solution Approach 1:
The patent applies beforehand cushioning by designing pocket sidewalls with inclined surfaces that create a cushioning effect before damage can occur. The inclined sidewalls allow the chip stack to settle at an angle, distributing mechanical stresses and preventing direct impact forces during transportation, thereby protecting the fragile semiconductor structure from damage and contamination beforehand
Solution Approach 2:
The patent applies nesting by placing the semiconductor chip stack structure inside a molded cavity within the carrier pocket. The molding member creates a nested configuration where the chip stack is enclosed within the pocket structure, providing multiple layers of protection against external contaminants and mechanical damage during handling and transport
2Ease of manufacture
If carrier pockets have vertical sidewalls for simple manufacturing, then production is easier, but chip stack structures lack stable positioning and are prone to movement
Solution Approach 1:
The patent applies asymmetry by designing the pocket sidewalls with inclined surfaces rather than vertical walls. The inclined sidewalls create an asymmetric geometry that provides stable positioning for the chip stack structure, preventing lateral movement while still allowing for practical manufacturing through molding processes
Solution Approach 2:
The patent applies curvature principles by using inclined surfaces on the pocket sidewalls instead of sharp vertical edges. The angled surfaces create a smoother transition zone that stabilizes the chip stack positioning while reducing stress concentration points, balancing manufacturing ease with structural stability
3Stability of the object's composition
If carrier pockets have large contact area with chip stacks for stability, then positioning is improved, but contamination risk increases due to greater exposure
Solution Approach 1:
The patent applies nesting by enclosing the chip stack within a molded cavity in the carrier pocket. This nested configuration provides stable accommodation through the cavity walls while simultaneously reducing contamination risk by limiting direct exposure of the chip stack to the external environment, achieving both stability and protection
Data Source
AI summary
A carrier structure including semiconductor chip stack structures; and a carrier tape including a plurality of pockets respectively accommodating the semiconductor chip stack structures, wherein each of the plurality of pockets includes a bottom surface, first sidewalls in four corner regions of each of the plurality of pockets, and second sidewalls between adjacent first sidewalls, each of the first sidewalls has a first portion having a first inclination angle and a second portion on the first portion and having a second inclination angle, the second inclination angle being greater than the first inclination angle, and vertices of lower surfaces of the semiconductor chip stack structures are in contact with the first sidewalls.