Carrier Proximity Mask for AR Substrate Processing
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Solution Overview
Problem
Current substrate processing techniques face challenges in forming small-dimensional device structures, such as gratings and light wave guides, which are essential for augmented reality glasses, as they require precise masking to avoid damage and distortion, and existing methods are inefficient in handling flexible substrates like glass without adding metal reinforcement.
Innovation Solution
A carrier proximity mask system comprising a first and second carrier body with openings and contact areas that align with the substrate's sides, allowing non-contact handling and processing of both sides of the substrate, using clamps to suspend the substrate between the carrier bodies, and employing angled edges to convolve with ion beams for creating variable etch depth profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing masking techniques are used to form small-dimensional device structures, then manufacturing precision can be maintained, but processing efficiency decreases and substrate deformation increases
Solution Approach 1:
The mask is divided into multiple segments corresponding to different device regions, allowing selective processing of different areas simultaneously. Each segment can be independently positioned and processed, enabling parallel manufacturing operations while maintaining precise dimensional control for each device structure.
Solution Approach 2:
The invention transitions from planar masking to three-dimensional carrier-based masking, where substrates are mounted on carriers that provide additional dimensional stability and positioning accuracy. This enables simultaneous processing of multiple substrates in vertical arrangement, improving productivity without sacrificing manufacturing precision.
2Strength
If metal reinforcement is added to flexible substrates like glass, then substrate strength increases, but device complexity and processing steps increase
Solution Approach 1:
A carrier serves as an intermediary structure that provides mechanical support and strength to flexible substrates during processing. The carrier absorbs the structural reinforcement function, eliminating the need for metal reinforcement layers on the substrate itself, thereby reducing device complexity and processing steps while maintaining substrate strength.
Solution Approach 2:
The invention replaces the mechanical reinforcement approach (adding metal layers to substrates) with a carrier-based support system. The carrier provides the necessary mechanical strength through its structure and clamping mechanism, eliminating complex substrate modification steps and simplifying the overall device architecture.
3Ease of operation
If direct handling of substrates is performed, then ease of operation improves, but substrate deformation and distortion increase
Solution Approach 1:
The carrier acts as an intermediary between the handling system and the substrate, providing clamping and support points that distribute mechanical stresses. This eliminates direct contact with sensitive substrate areas, preventing deformation and distortion while maintaining ease of operation through standardized carrier handling interfaces.
Solution Approach 2:
The carrier provides localized support and clamping at specific contact points, ensuring that only necessary areas are constrained while leaving work areas accessible. This selective local support prevents substrate deformation in critical regions while maintaining operational ease through targeted mechanical engagement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient processing of both sides of the substrate without direct handling, reduces processing steps and costs, and allows for the precise formation of diffraction optical elements and wave guides in augmented reality glasses by minimizing substrate deformation and distortion.
Implementation Method 1
The one or more contact areas of the first carrier body and the one or more contact areas of the second carrier body may contact opposite sides of the substrate to suspend a work area of the first side of the substrate and a work area of the second side of the substrate between the first carrier body and the second carrier body
Implementation Method 2
employing angled edges to convolve with ion beams for creating variable etch depth profiles
Implementation Method 3
processing, with a processing tool, the work area on the first side of the substrate via the one or more openings to form the structures on the first side of the substrate
Data Source
AI summary
A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.