Carrier Proximity Mask for Substrate Processing
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Solution Overview
Problem
The challenge in substrate processing for devices such as augmented reality glasses lies in creating small dimensions and complex structures like gratings and light wave guides without damaging the substrate or introducing distortions, which is difficult due to the need for precise handling and masking during etching and deposition processes.
Innovation Solution
A carrier proximity mask system is used, comprising a first and second carrier body with openings and contact areas that align with the substrate to suspend and mask both sides, allowing for non-contact processing and variable etch depth profiles by convolving ion beams with edges of the openings, thereby reducing processing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If direct handling and masking during etching and deposition processes is used, then processing can be performed, but substrate deformation and distortion occur
Solution Approach 1:
A carrier proximity mask system is introduced as an intermediary device between the processing tool and the substrate. The carrier body with precision openings allows processing while the mask structure itself prevents direct contact that causes deformation. The mask acts as a mediator that enables processing operations while protecting the substrate from handling-induced distortion.
Solution Approach 2:
The patent replaces traditional mechanical handling and masking systems with a proximity mask system that uses precise geometric structures and spacing. Instead of direct mechanical contact for masking, the system uses the proximity effect where the carrier body with openings defines the processing areas without requiring physical contact with the substrate surface, thereby eliminating mechanical deformation.
2Reliability
If traditional masking methods are used to protect substrate structures, then damage can be avoided, but processing steps and costs increase
Solution Approach 1:
The carrier body and mask function are merged into a single integrated structure. The carrier body itself contains the precision openings that serve as the mask pattern, eliminating the need for separate mask application and removal steps. This consolidation reduces processing steps while maintaining reliable protection of substrate structures through the precision openings.
Solution Approach 2:
The carrier proximity mask system serves multiple functions simultaneously: it provides structural support to prevent substrate deformation, defines the processing pattern through its openings, and protects non-processing areas. This multi-functionality reduces the number of separate processing steps required compared to traditional sequential masking methods.
3Manufacturing precision
If small dimensions and complex structures are created, then device functionality is improved, but processing difficulty increases
Solution Approach 1:
The carrier proximity mask is prepared in advance with precision openings that define the exact pattern for small-dimension structures. By pre-defining the complex pattern in the mask rather than creating it during processing, the system enables fabrication of complex structures with small dimensions while reducing the complexity of the actual processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient processing of both sides of the substrate without direct handling, reducing deformation and distortion, and allows for precise formation of complex structures like diffractive optical elements and wave guides, enhancing the quality and efficiency of substrate processing.
Implementation Method 1
The one or more contact areas of the first carrier body and the one or more contact areas of the second carrier body may contact opposite sides of the substrate to suspend a work area of the first side of the substrate and a work area of the second side of the substrate between the first carrier body and the second carrier body
Implementation Method 2
a beam from a processing tool may convolve with a first edge of the edges in a first opening to create a convolved beam. The convolved beam may etch a work area of the substrate exposed by the first opening to create a variable etch depth profile in the substrate proximate to the first edge
Data Source
AI summary
A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.