Semiconductor Carrier Recesses Prevent Bump Collapse
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Solution Overview
Problem
Existing semiconductor device carrier units face issues during transportation where the bumps on the connecting substrate can collapse when the pressing cap and carrier housing are combined without a bare chip, leading to packaging and unpacking difficulties and air cleanliness concerns in test stations.
Innovation Solution
A semiconductor device carrier unit with a pressing member having recesses larger than the bumps on the connecting substrate, preventing collapse and ensuring secure housing even without the bare chip, and a semiconductor socket designed for detachable housing with contacts for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pressing cap and carrier housing are combined without a bare chip, then the structure is simple and easy to manufacture, but the bumps on the connecting substrate collapse
Solution Approach 1:
The pressing cap is designed with recesses at positions corresponding to the bumps on the connecting substrate. These recesses act as predetermined cushioning structures that receive and protect the bumps when the pressing cap is combined with the carrier housing without a bare chip, preventing collapse while maintaining manufacturing simplicity
2Reliability
If cushioning material is interposed between bumps and pressing portions, then bump collapse is prevented, but packaging and unpacking become troublesome and air cleanliness deteriorates
Solution Approach 1:
The cushioning function is extracted from the traditional approach of using separate cushioning materials and is instead integrated directly into the pressing cap structure through recesses. This eliminates the need for separate cushioning materials, simplifying packaging and unpacking operations while maintaining bump protection and air cleanliness
3Reliability
If the pressing member has recesses larger than bumps, then bump collapse is prevented during transportation, but the pressing member structure becomes more complex
Solution Approach 1:
The pressing cap maintains a simple overall structure but introduces localized recesses only at specific positions corresponding to the bumps. This local modification provides the necessary protection without requiring complex structural changes throughout the entire pressing member, balancing reliability improvement with structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bump collapse during transportation and simplifies packaging and unpacking, maintaining air cleanliness in test stations by ensuring secure and stable housing of the semiconductor device without the need for cushioning materials.
Implementation Method 1
a spring 18 disposed in a space between the base of the pressure body 16 and an inner surface defining the recess of the cap body 20 for biasing the pressure body 16 toward the bare chip
Implementation Method 2
torsion coil springs (not shown) for biasing the hook members 10FA, 10FB in the direction of being engaged with the nibs 2N
Data Source
AI summary
In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.