Carrier Structure Recesses Micro LED Transfer
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Solution Overview
Problem
Current micro LED display manufacturing techniques face bottlenecks in die transfer methods, including high manufacturing costs, low transfer success rates, and poor alignment accuracy due to issues with electrostatic force, van der Waals force, and viscous material methods, which hinder efficient mass transfer and dense arrangement of micro LED dies on a carrier.
Innovation Solution
A carrier structure with recesses and transfer units, where the transfer units are disposed in the recesses and have transferring surfaces that can be aligned or protrude from the carrier surface, providing a supporting force to micro devices with controlled contact areas and Young's modulus differences to enhance transfer uniformity and supporting force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If electrostatic force method is used to extract dies, then extraction capability is improved, but risk of arcing and dielectric breakdown increases
Solution Approach 1:
The patent introduces a transfer carrier with transfer units as an intermediary between the micro LED dies and the final substrate. This carrier mediates the transfer process, allowing extraction and placement without direct electrostatic interaction that causes arcing and dielectric breakdown, thus maintaining extraction capability while improving reliability
Solution Approach 2:
The patent replaces the electrostatic force method with a mechanical transfer system using a transfer carrier with transfer units. This mechanical system provides extraction capability through physical contact and manipulation, eliminating the risks associated with electrostatic forces while maintaining effective die transfer
2Force
If van der Waals force method is used to extract dies, then extraction capability is improved, but transfer success rate decreases due to need for precise control
Solution Approach 1:
The transfer carrier acts as an intermediary that simplifies the transfer process. Instead of requiring precise control of van der Waals forces between stamper and dies, the carrier provides a stable platform with transfer units that mechanically engage with the dies, maintaining extraction capability while significantly improving transfer success rate through more forgiving mechanical interactions
Solution Approach 2:
The patent changes the interaction parameters from molecular-level van der Waals forces to macroscopic mechanical contact through transfer units. This parameter change from nanoscale to microscale interactions reduces the precision requirements and improves transfer success rate while maintaining effective extraction capability
3Force
If viscous material method is used to stick dies, then adhesion is improved, but alignment accuracy and adhesion uniformity deteriorate
Solution Approach 1:
The transfer units on the carrier serve as intermediaries between the viscous material and the micro LED dies. Instead of applying viscous material directly to the dies for sticking, the transfer units mediate the adhesion process, providing controlled contact areas that improve alignment accuracy while maintaining sufficient adhesion through the transfer units' interaction with the material
Solution Approach 2:
The patent applies local quality by confining the viscous material interaction to specific contact areas on the transfer units rather than uniform application across the entire die surface. This localized adhesion approach improves alignment accuracy by defining precise contact zones while maintaining sufficient adhesion strength through concentrated interaction points
4Strength
If support structure is disposed on peripheral surfaces of dies, then structural support is improved, but arrangement density deteriorates
Solution Approach 1:
The patent transitions from two-dimensional peripheral support to three-dimensional transfer units that extend above the carrier surface. This dimensional change allows support structures to provide structural support through vertical engagement while minimizing horizontal footprint, thereby enabling higher arrangement density of micro LED dies on the carrier
Solution Approach 2:
The support system is segmented into multiple discrete transfer units rather than continuous peripheral support. Each transfer unit provides localized structural support at specific die locations, allowing dense arrangement of dies while maintaining adequate support through the distributed network of transfer units across the carrier surface
Data Source
AI summary
A carrier structure suitable for transferring or supporting a plurality of micro devices includes a carrier and a plurality of transfer units. The carrier has a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surfaces are exposed. Each micro device has a device surface. The transferring surface of each transfer unit is configured to be connected to the device surface of the corresponding micro device. A micro device structure including the carrier structure is also provided.