Optoelectronic Component Carrier Recesses for Precise Chip Positioning
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Solution Overview
Problem
There is a need for a cost-effective method to produce optoelectronic components, particularly light-emitting diodes, that efficiently integrates semiconductor chips with cover materials while ensuring precise positioning and reproducible shapes.
Innovation Solution
The method involves providing a carrier with recesses, applying drops of cover material, introducing optoelectronic semiconductor chips, and curing the material to form cover bodies that are convexly shaped, with recesses acting as stop edges for precise positioning and shape formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to produce optoelectronic components, then production can proceed with standard processes, but manufacturing cost is high and positioning accuracy is insufficient
Solution Approach 1:
The method applies cover material drops to the carrier before introducing the semiconductor chips. The recesses are pre-formed in the carrier to define precise positions and shapes. This preliminary preparation enables automatic positioning of chips and consistent cover body formation, improving manufacturing precision while maintaining cost-effectiveness through a streamlined process
Solution Approach 2:
The carrier with pre-formed recesses serves as an intermediary structure between the cover material and the semiconductor chips. The recesses act as molds that define the shape and position of the cover bodies, enabling precise positioning without complex alignment mechanisms. This intermediary structure simplifies the overall manufacturing process while achieving high positioning accuracy
2Manufacturing precision
If complex positioning mechanisms are used, then positioning accuracy improves, but device complexity increases
Solution Approach 1:
The recesses in the carrier automatically define the position and shape of the cover bodies. When cover material is applied to the carrier, it naturally fills the recesses and forms precisely positioned cover bodies. The semiconductor chips are introduced into these pre-formed structures, achieving self-positioning without complex alignment mechanisms. This self-service approach maintains simplicity while achieving high positioning accuracy
Solution Approach 2:
The carrier is pre-formed with recesses that define the exact positions and shapes needed. This preliminary structuring eliminates the need for complex positioning mechanisms during assembly. The pre-defined geometry of the recesses guides the cover material and chip placement, reducing process complexity while ensuring consistent positioning accuracy
3Reliability
If multiple production steps are used, then component quality improves, but productivity decreases
Solution Approach 1:
The method combines multiple functions into a single integrated process: the carrier provides structural support, the pre-formed recesses define positioning and shaping, the cover material application creates protective cover bodies, and the semiconductor chip introduction completes the assembly. These steps are performed in a unified sequence without requiring separate positioning or alignment operations, maintaining component quality while improving production efficiency
Solution Approach 2:
The carrier is pre-prepared with recesses that define the final shape and position of cover bodies. This preliminary structuring allows subsequent steps (cover material application and chip introduction) to proceed directly without additional positioning or shaping operations. The pre-formed geometry enables a streamlined multi-step process that maintains quality while reducing overall production time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective production of optoelectronic components with high positioning accuracy and reproducible shapes, ensuring efficient integration of semiconductor chips and cover materials, thereby enhancing the production efficiency of optoelectronic components like light-emitting diodes.
Implementation Method 1
The drops are surrounded by recesses in the carrier, in particular completely surrounded. The recesses in the carrier thus form a stop edge for the cover material during introduction of the optoelectronic semiconductor chip into the drops. The drops are cured with UV irradiation, for example, into the cover bodies
Data Source
AI summary
A method of producing an optoelectronic component includes providing a carrier, generating a plurality of recesses in the carrier, applying a plurality of drops of a cover material to the carrier, introducing an optoelectronic semiconductor chip including a semiconductor body and contact elements on an underside of the semiconductor body into at least some of the drops, and curing the drops of the cover material into cover bodies, wherein at least some of the drops are completely surrounded by recesses in the carrier, and the recesses in the carrier are a stop edge for the cover material during introduction of the optoelectronic semiconductor chip.